BAE Systems Technology to Detect and Track Other Subs
July 18, 2017 | Business WireEstimated reading time: Less than a minute
The U.S. Defense Advanced Research Projects Agency (DARPA) has awarded BAE Systems a $4.6 million contract for its Mobile Offboard Clandestine Communications and Approach (MOCCA) program. The MOCCA program’s goal is to enable submarines to detect other submerged vessels at greater distances, while minimizing the risk of counter-detection.
“Advances in maritime technology are critical to the Department of Defense and an area where the U.S. military can continue to strengthen its advantage,” said Geoff Edelson, director of Maritime Systems and Technology at BAE Systems. “With the resurgence of near-peer competitors and an increasing number of submarines, MOCCA technology will provide Navy submariners with a vital asymmetrical advantage against a rapidly proliferating undersea threat.”
To meet the MOCCA program’s ambitious Phase 1 goals, BAE Systems’ researchers will design efficient sonar capabilities to maximize detection range and improve target identification and tracking.
The MOCCA program demonstrates BAE Systems’ strength in innovation and its capability to design technologies for future combat scenarios. The research and development team at BAE Systems regularly works closely with DARPA and other defense research institutes to create and deliver capabilities that improve the competitive advantages of the U.S. armed forces.
Suggested Items
IDTechEx Report on Quantum Technology: Nano-scale Physics for Massive Market Impact
04/30/2024 | PRNewswireThe quantum technology market leverages nano-scale physics to create revolutionary new devices for computing, sensing, and communications. Across the industry, quantum technology offers a paradigm shift in performance compared with incumbent solutions.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
Koh Young Extends Invitation to the 2024 IEEE Electronic Components and Technology Conference
04/30/2024 | Koh YoungKoh Young, the industry leader in True3D measurement-based inspection solutions, invites you to join us at the at the 2024 IEEE Electronic Components and Technology Conference from May 28-31, 2024, in Denver, Colorado at the Gaylord Rockies Resort & Convention Center.
Samsung Electronics Begins Industry’s First Mass Production of 9th-Gen V-NAND
04/29/2024 | Samsung ElectronicsSamsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass production for its one-terabit (Tb) triple-level cell (TLC) 9th-generation vertical NAND (V-NAND), solidifying its leadership in the NAND flash market.
TSMC Celebrates 30th North America Technology Symposium
04/29/2024 | TSMCTSMC unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium.