MacDermid Enthone Electronics Solutions Launches MacuSpec AVF 700 Process
September 14, 2017 | MacDermid Enthone Electronics SolutionsEstimated reading time: 1 minute
MacDermid Enthone Electronics Solutions, a MacDermid Performance Solutions business, announces the release of the MacuSpec AVF 700 process, a high performance electrolytic copper metallization for the filling of microvias in printed circuit boards. AVF 700 allows for the removal of conventional process steps such as flash plate, microetch, and predip, while providing a stronger direct copper-to-copper bond for enhanced reliability of vias. With AVF 700 customers get all of this with a very low amount of surface copper plating, requring little to no post processing thickness reduction.
Bill Bowerman, Director of Metallization, MacDermid Enthone, noted, “The release of MacuSpec AVF 700 further demonstrates MacDermid Enthone Electronics Solutions’ commitment to offering the most extensive and highest performing metallization process portfolio available in the electronics manufacturing industry today. Combined with our industry leading direct metallization solutions we can completely revolutionize customers’ bottom lines through cost savings, environmental benefits, and improved performance and reliability. MacuSpec AVF 700 is the advanced via fill choice for 'Anylayer' HDI designs and MacDermid Enthone is the only company that can achieve this unique value proposition.”
About MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions researches, formulates and delivers specialty chemistries used in the world’s leading electronics. Our products and technical support provide solutions for the most complicated, micro scale circuitry challenges. From wireless devices to automotive and military electronics – in everything you see, and in many things you don’t – MacDermid Enthone is there. Click here for more information.
Suggested Items
Electronics Industry Sentiment Rose in April, Hitting New High
05/02/2024 | IPCApril 2024 marked the third consecutive month of sentiment growth among electronics manufacturers. When asked if they expected labor costs for hourly workers to rise over the next month, manufacturers in the United States, Mexico, and Europe predicted a five percent increase, while manufacturers in Asia predicted a slightly lower four percent increase.
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
NextFlex Convenes the Hybrid Electronics Community at Binghamton University
05/01/2024 | NextFlexBinghamton University hosted the NextFlex hybrid electronics community on April 18 for a day of expert presentations, breakout sessions on technology and manufacturing topics, and networking.
HQ NextPCB of HQ Electronics Debut on the International Stage for Electronics Manufacture at IPC APEX 2024
05/01/2024 | PRNewswireHQ NextPCB of HQ Electronics, a leading Chinese-based multilayer PCB manufacturer and assembly house showcased its industrial prowess on the international stage for the first time at the IPC APEX Expo 2024.