-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
CES 2020: Here We Are Again
January 7, 2020 | Dan Feinberg, Technology Editor, I-Connect007Estimated reading time: 10 minutes
I expect to see more foldable phones this year and a plethora of them a year from now. LG was showing a new foldable phone offering, and it looks like we will see more from them.
The Pix Backpack allows you (or your kids) to load any message or graphic onto the back of this backpack and will certainly be noticed.
And then there is the amazing Samsung 8K TV, but there will be more on TVs later when we get a chance to walk the show floor.
There were many more things to see at Unveiled, but many of them, while being interesting, were not advanced technology. New technology announcements will start at the beginning of the week.
Panasonic
The first press event of the day for me was Panasonic, who has become one of the leading consumer electronics companies globally. Their press events are usually very entertaining, and this one was no exception. Here are their major announcements.
- Olympic partnerships with Michael Phelps, Katie Ledecky, Lex Gillette, and Sakura Kokumai as part of the “Team Panasonic” initiative
- Samsung will provide advanced native 4K projector technology for immersive entertainment onboard select Princess Cruises starting this year
- eBike safety standard certification using Samsung technology has been granted
- “Mario & Sonic at the Olympic Games in Tokyo 2020” video games will be available in partnership with SEGA
- National Stadium will be upgraded with large screens and audio-visual equipment for the Tokyo 2020 Olympics using Samsung technology
- CIRRUS by Panasonic is a connected vehicle data platform being recognized by CES as a 2020 Innovation Award Honoree
It was also obvious that Panasonic is focused on the Tokyo Olympics as well as their collaboration with Disney for their “Star Wars: Galaxy’s Edge” areas at Disneyland.
They are also working with various Airline partners for inflight entertainment as well as the new on-board flight map displays for passengers. A version will be available on roadways for automotive. Further, they announced a partnership with Klipsch and Fender for high-end automotive sound in addition to Google.
Other announcements were regarding their partnership with Tropos Motors for small electric work vehicles as well as small, electric-powered, fire-response trucks as well as electric bike bikes, connected vehicles, and electric Harley Davidson motorcycles. Also, Samsung is partnering with CIRRUS Connected, and their roadway data system will be implemented in Utah over the next few years. There will be 30 vehicles and 40 sites in phase one, but then there will be exponential expansion. A few other things to expect from them include OLED TVs, bass enhanced wireless headsets, etc.
The following will be shown at the Panasonic booth when the show floor opens.
- A replica of a transportation network operator center powered by CIRRUS by Panasonic
- Two Tropos eCUV concept trucks, an emergency firetruck, and a refrigeration cargo truck
- Harley-Davidson LiveWire Electric Motorcycles powered by OneConnect
- eCockpit concept with SkipGen 3.0S and SPYDR 3
- WHILLNext autonomous wheelchair
- VR glasses, high-speed projection mapping, Technics SL-1200MK7 turntable, and intelligent living spaces, such as connected home technology
This year, Panasonic is almost a show all by themselves.
Page 2 of 4
Suggested Items
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Standard Of Excellence: The Products of the Future
09/19/2023 | Anaya Vardya -- Column: Standard of ExcellenceIn my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering
09/18/2023 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
09/18/2023 | IntelIntel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.