Keysight, Synergy Advance 5G O-RAN Development
December 16, 2022 | Business WireEstimated reading time: 1 minute
Keysight Technologies, Inc., a leading technology company that delivers advanced design and validation solutions to help accelerate innovation to connect and secure the world, and Synergy Design Technologies are expanding a collaboration to advance the development of 5G Open Radio Access Network (O-RAN) and Virtualized Radio Access Network (vRAN) infrastructures. Through the collaboration, Synergy will use Keysight’s user equipment (UE) emulation solutions to
With the increasing complexity of mobile network ecosystems and the evolution of RAN technologies, infrastructure vendors need accurate and efficient network performance testing solutions to ensure functionality across all interfaces. UE emulation solutions replicate real network traffic to validate end-to-end RAN performance and improve product design.
Synergy will employ Keysight’s P8800S UE Emulation RAN (UeSIM) and P8822S UE/O-RU Emulation Over the O-RAN Fronthaul (RuSIM) solutions to create a network test environment supporting the development and troubleshooting of its software-based 5G Smart RAN solution. Using both UE emulation platforms, Synergy will be able to validate its all-in-one small cells as well as O-RAN radio units (O-RUs), distributed units (O-DUs), and central units (O-CUs) allowing for continuous product optimization and design enhancements.
Keysight’s UeSIM UE emulation solutions enable infrastructure vendors, chipset providers, and mobile operators to validate end-to-end RAN performance by emulating real network traffic over both radio and O-RAN fronthaul interfaces. RuSIM enables functional, conformance, and performance testing of O-DUs over fronthaul functional split option 7.2x.
Cao Peng, Vice President and General Manager for Keysight's Wireless Test Group, said: “In 2021, Keysight and Synergy initiated a collaboration on test solutions that enable a connected global ecosystem of O-RAN vendors, mobile operators, and test labs to create end-to-end performance verification environments based on real-world data. We are delighted to continue to support Synergy in their development of vertically-integrated software solutions, from RF and open fronthaul validation to conformance testing and from low/high PHY to higher layers protocol stack testing.”
Paul Li, President at Synergy Design Technology, said: “Keysight’s UeSIM and RuSIM are enabling Synergy to continuously optimize and enhance our software. We’re pleased to expand our partnership to advance the development of our 5G Smart RAN technology design and reduce time-to-market, which is thanks to Keysight’s complete end-to-end, interoperability, and conformance test solutions portfolio."
Suggested Items
Real Time with… IPC APEX EXPO 2024: My Role as a Technology Solutions Director
05/02/2024 | Real Time with...IPC APEX EXPOPeter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers
05/02/2024 | I-Connect007In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.