SIA Urges Full Funding of CHIPS & Science Act Research Programs in President’s FY24 Budget
February 15, 2023 | SIAEstimated reading time: 1 minute
Semiconductor Industry Association (SIA) President and CEO John Neuffer sent a letter to Office of Management and Budget Director Shalanda Young, encouraging her to include in the President’s Budget Request for Fiscal Year 2024 (FY24) full funding for research and workforce programs authorized by the CHIPS and Science Act of 2022.
“SIA applauds Congress and the Administration for passage and enactment of the CHIPS and Science Act, which provided historic increases in funding for American innovation through programs at the National Science Foundation (NSF), Department of Energy Office of Science (DOE-SC), National Institute of Standards and Technology (NIST), and Department of Commerce Economic Development Administration (EDA),” Neuffer wrote. “To uphold the promise and opportunity of the CHIPS and Science Act, it is pivotal that the Administration and Congress support these programs at the fully authorized level.”
The letter also expresses SIA’s support for robust funding for Department of Defense (DOD) basic research programs, DARPA, the Trusted and Assured Microelectronics Program, and the Microelectronics Commons.
Neuffer added in the letter, “Federal R&D programs have a substantial return on investment throughout the economy, advancing innovations in new technologies that enable progress in such fields as computing, energy, manufacturing, AI, health care, space, telecommunications, and defense. The President’s budget and congressional appropriations should follow through on the historic commitments of the CHIPS and Science Act in order to support a vibrant American innovation ecosystem.”
SIA looks forward to working with the Administration and Congress to advance these important priorities for R&D, innovation, and workforce development.
Suggested Items
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
HCLTech Launches EDA Solution Powered by NetApp to Accelerate EDA Workloads in the Cloud
04/11/2024 | HCLTechHCLTech, a leading global technology company, announced the launch of an Electronic Design Automation (EDA) solution in partnership with NetApp, to enable enterprises in the semiconductor industry to accelerate large EDA implementations in the hybrid cloud to significantly reduce their time-to-market, enhance the overall quality and improve the reliability of their products.
Cadence Continues ‘Left Shift’ of SI Functions
02/29/2024 | I-Connect007 Editorial TeamAt DesignCon, the I-Connect007 Editorial Team met with Brad Griffin, product marketing group director for the System Analysis Group at Cadence Design Systems. Brad explains how this analysis tool enables designers to address SI and PI issues early in the design process, before they become costly errors, and why he believes his late co-worker Dennis Nagel would be proud to see his efforts come to fruition.
Keysight, Intel Foundry Partner to Certify Electromagnetic Simulation Software for Intel 18A Process Technology
02/22/2024 | BUSINESS WIREKeysight Technologies, Inc. announces that the RFPro electromagnetic (EM) simulation software, part of the Keysight EDA Advanced Design System (ADS) integrated tool suite, is now certified by Intel Foundry for design engineers targeting Intel 18A process technology.
Beyond Design: Embedded Capacitance Material
02/22/2024 | Barry Olney -- Column: Beyond DesignEmbedding components into the multilayer PCB substrate can have many benefits, including reduced board size and improved signal integrity. However, embedded capacitance material (which is not really a component but rather part of the substrate) can improve power integrity dramatically by reducing AC impedance and generally enhancing the performance of the product. It takes up no additional space, is easy to implement (because it is compatible with standard FR-4 processes), and can be cost-effective.