SHENMAO's New Anti-HoP Lead-Free Solder Paste Developed to Prevent HoP Issues
March 13, 2023 | SHENMAO America, Inc.Estimated reading time: Less than a minute
SHENMAO America, Inc. has released its new Anti-HoP Lead-Free Solder Paste PF606-P130N. The paste is specially designed for the SMT process to prevent head-on-pillow (HoP) issues.
The demand for ultra-thin packages has increased, thus the reduction in package thickness has caused increased warpage. The warpage during the reflow process increases the gap between BGA components and solder paste, leading to HoP issues and production yield loss.
PF606-P130N features great flux activity that can prevent oxidation of solder powder during the reflow process. Furthermore, the new paste shows excellent solderability and hot slump performance to cover the warpage of components and prevent BGA/CSP HoP issues.
PF606-P130N is designed for the SMT process, especially for thin BGA package components.
Suggested Items
AIM Solder Appoints Mhanny Aguillo as Southeast Asia Technical Sales Manager
05/31/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials, is pleased to announce the appointment of Mhanny Aguillo as the Southeast Asia Technical Sales Manager.
Merlin Flex Invests in New Techwin Solder Mask Developer
05/31/2024 | Merlin Flex LtdMerlin Flex Continue their investment programme with the installation & commissioning of a new Techwin Solder Mask Developer. This new machine allows faster & more accurate developing in the solder mask process.
IPC Hand Soldering Competition Thailand 2024
05/29/2024 | IPCIPC’s hand soldering competitions around the world are highly popular events generating a lot of attention, participation and publicity. The competition attracts the enthusiastic participation of thousands of professionals specializing in high-reliability products within the electronics industry such as defense, aerospace/aviation, rail transportation, automotive electronics, consumer electronics, etc.
AIM Solder Joins International Electronics Manufacturing Initiative (iNEMI)
05/29/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials, is proud to announce its membership with the International Electronics Manufacturing Initiative (iNEMI).
Real Time with… IPC APEX EXPO 2024: Advanced Technologies with BlueRing Stencils
05/28/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and Greg Smith, manager of stencil technology with BlueRing Stencils, discuss the company's capabilities and services. They explore the use of nano coatings for thin stencils and determining the area ratio. Greg emphasizes the role of stencil artwork in controlling solder deposition and the need for collaboration between designers and stencil companies. They also focus on thinner stencils and step stenciling techniques for achieving proper solder deposition.