Battery Workforce Challenge Announced by Argonne National Laboratory
March 27, 2023 | Business WireEstimated reading time: 1 minute
The U.S. Department of Energy’s (DOE) Argonne National Laboratory announced the launch of the Battery Workforce Challenge, which includes a three-year collegiate engineering competition, focused on advanced battery design and development that will build a diverse, highly-skilled electric vehicle (EV) Battery Workforce to help our nation transition to electric mobility and clean energy.
Argonne, a DOE research and development center, will manage the competition for the co-sponsors DOE and Stellantis. This government and industry partnership will build the next generation of engineers, technicians, and workers to address the unprecedented demand for a domestic EV Battery workforce.
The Battery Workforce Challenge includes an advanced battery design and development student competition series that invites universities and vocational schools from across North American to design, build, test and integrate an advanced EV battery into a future Stellantis vehicle. The challenge kicks off in fall of 2023 and 11 universities will be selected to participate.
“American leadership in the global battery supply chain will be based not only on our innovation, but also on our skilled workforce of engineers, designers, scientists, production workers, and technicians,” said Deputy Assistant Secretary for Sustainable Transportation and Fuels at DOE, Michael Berube. “This comprehensive workforce program will build an educational ecosystem delivering training and education for high school graduates, and vocational and transitional workers, fostering a diverse talent pipeline of trained engineers, workers and technicians who can charge North America’s battery industry forward.”
Additional workforce and education initiatives will complement the challenge, including a national Career-Connected Learning Management System to provide flexible, accessible, and equitable training for learners across the education pipeline.
Suggested Items
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers
05/02/2024 | I-Connect007In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.