FLEX Conference 2023 to Spotlight Flexible Hybrid Electronics, PE, Advanced Packaging
April 4, 2023 | SEMIEstimated reading time: 1 minute
The FLEX Conference will gather industry experts July 11-13, 2023, at the Moscone Center in San Francisco for keynotes, panel discussions, technical sessions and product-based demonstrations highlighting the latest innovations in flexible hybrid electronics (FHE), printed electronics and advanced packaging including heterogeneous integration. Hosted by SEMI, FLEX is now part of SEMICON West, North America’s premier microelectronics exhibition and conference that unites players across the entire electronics manufacturing and design supply chain. Registration for both events is open.
Themed Intelligently Flexible, FLEX Conference 2023 will attract global industry professionals from more than 150 companies, R&D labs, and government agencies as the event focuses on equipment, processes, materials and applications driving the latest FHE technology breakthroughs. FLEX will also showcase innovations emerging from public-private partnerships formed by SEMI Technology Communities SEMI-FlexTech, SEMI-NBMC (Nano-Bio Materials Consortium) and SEMI-NextFlex.
“FLEX showcases advancements in next-generation electronics packaging accelerating industry growth,” said Melissa Grupen-Shemansky, CTO and Vice President of Technology Communities at SEMI. “Companies pushing the boundaries of heterogeneous integration will join FlexTech, NBMC and NextFlex innovators as they present cutting-edge research and development to advance industry technical knowledge through papers, posters and product information.”
“FLEX is a leading forum for networking with colleagues passionate about flexible hybrid electronics,” said Robert Praino, Chief Innovation Officer and Co-Founder of Chasm Advanced Materials Inc. and chairman of the FLEX Executive Planning Committee. “We’ve combined compelling industry topics with abundant deep dives into areas of common interest for learning across the ecosystem. The FLEX executive committee has worked to ensure rich technical content, consistent with the event’s tradition over the past 20-plus years, that promises to shed new light on business and innovation opportunities ahead.”
Suggested Items
Latest Test and Inspection Solutions from GOEPEL electronic at SMTconnect 2024
04/29/2024 | GOEPEL electronicGOEPEL electronic will be demonstrating automated test and inspection equipment at SMTconnect, taking place in Nuremberg from June 11 to 13, 2024.
Arlon Electronic Materials Awarded Requalification to IPC-4101 QPL for All Polyimide Specification Sheets
04/29/2024 | IPCIPC's Validation Services Program has awarded Arlon Electronic Materials Division, an electronics material manufacturing company headquartered in Rancho Cucamonga, Calif., an IPC-4101 Qualified Products Listing (QPL) requalification for the third time.
Warm Windows and Streamlined Skin Patches – IDTechEx Explores Flexible and Printed Electronics
04/26/2024 | IDTechExFlexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use. From luminous car controls to food labels that communicate the quality of food, the uses of this technology are endless and can upgrade many areas of everyday life.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics
04/24/2024 | I-Connect007 Editorial TeamIn our fast-changing, deeply competitive, and margin-tight industry, factory analytics can be the key to unlocking untapped improvements to guarantee a thriving business. On top of that, electronics manufacturers are facing a tremendous burden to do more with less. If you don't already have a copy of this book, what follows is an excerpt from the introduction chapter of 'The Printed Circuit Assembler’s Guide to... Factory Analytics: Unlocking Efficiency Through Data Insights' to whet your appetite.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.