Cadence Joins Arm Total Design to Accelerate Development of Arm-Based Custom SoCs
October 18, 2023 | Cadence Design Systems, Inc.Estimated reading time: 1 minute
Cadence Design Systems, Inc. announced it has joined Arm® Total Design, aimed at supporting and accelerating the development of highly differentiated custom SoCs based on Arm Neoverse™ Compute Subsystems (CSS). As part of this collaboration, Arm and Cadence customers can accelerate their SoC design process through access to Cadence’s full-flow system-level design verification and implementation solutions.
Neoverse CSS delivers world-class performance for the latest Arm CPUs and system IP on leading-edge technology. Cadence joining Arm Total Design will help mutual customers create differentiated products on a verified, customizable subsystem while reducing development costs, minimizing risk, and shortening the time-to-market for designs. The Cadence full-flow digital design, verification, and design IP solutions are validated for Arm Neoverse CSS, including the Cadence® Joint Enterprise Data and AI (JedAI) platform and generative AI-based solutions, which includes the Cadence Cerebrus™ Intelligent Chip Explorer and Verisium™ AI-Driven Verification Platform. Additionally, mutual customers will have access to turnkey Cadence Design Services to take Arm-based systems from concept to tapeout, helping achieve first-pass silicon success.
“Arm Total Design brings together critical expertise for empowering the industry to rapidly innovate on Neoverse CSS while taking advantage of the vast software ecosystem built around Arm,” said Mohamed Awad, senior vice president and general manager, Infrastructure Line of Business at Arm. “Cadence is bringing their expertise in system verification and digital implementation to Arm Total Design, enabling our joint customers with seamless support for advanced tools and flows, and streamlining custom silicon design on Arm.”
“Arm Neoverse CSS simplifies customers’ path to high-performance silicon by providing a complete compute subsystem that is drop-in ready for today’s high-performance system demands,” said Paul Cunningham, senior vice president and general manager of the System & Verification Group at Cadence. Cadence. “Cadence is happy to be part of Arm Total Design and help our mutual customers access solutions based on Neoverse CSS that will help them design differentiated products while lowering overall cost and shortening time-to-market.”
Cadence offers the broadest suite of generative AI solutions for chip to system design, built on the JedAI Platform and including the Cadence Cerebrus Intelligent Chip Explorer, Allegro® X AI Technology, Optimality™ Intelligent System Explorer, Verisium AI-Driven Verification Platform, and Virtuoso® Studio.
Suggested Items
Real Time with… IPC APEX EXPO 2024: My Role as a Technology Solutions Director
05/02/2024 | Real Time with...IPC APEX EXPOPeter Tranitz, senior director of technology solutions at IPC, shares insights into his role as the design initiative lead. He details his advocacy work, industry support, and the responsibilities of the design initiative committee. The conversation also covers the revamping of standards, the IPC Design Competition, and the implementation of design rules in software tools.
Real Time with… IPC APEX EXPO 2024: Ventec Discusses New Pro-bond Family of Advanced Products
05/01/2024 | Real Time with...IPC APEX EXPOChris Hanson, Ventec's Global Head of IMS Technology, outlines the launch of four pro-bond formulas that deliver an outstanding combination of low dissipation factor (Df) with a dielectric constant (Dk) range to maximize the design window for critical PCB parameters. As Chris points out, Pro-bond is designed for low-loss, high-speed applications, while thermal-bond dissipates heat from a component through the board to a heat sink.
IPC's Vision for Empowering PCB Design Engineers
04/30/2024 | Robert Erickson, IPCAs architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.
On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers
05/02/2024 | I-Connect007In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback.
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.