Improve Board Level Reliability by Reducing Solder Joint Voiding Below 10%
November 13, 2023 | MacDermid Alpha Electronics SolutionsEstimated reading time: 1 minute
MacDermid Alpha Electronics Solutions, a leader in integrated materials and technologies for the electronics industry, launches ALPHA® OM-362, its latest next-generation low-void solder paste.
ALPHA OM-362, next-generation ultra-low voiding solder paste
This lead-free, zero-halogen, no-clean paste can deliver less than 10% voiding on Bottom Termination Components (BTCs). The design characteristics of BTCs create void removal challenges during the soldering process, which can lead to ineffective thermal dissipation and mechanical strength in post-reflow applications. Low-voiding solder pastes are an important material in improving board level reliability by reducing this effect.
ALPHA OM-362 complies with the IPC Class III for voiding on BGA components.
Product flexibility
Designed for use with high-reliability ALPHA® Innolot solder and traditional SAC alloys, ALPHA OM-362 provides unmatched low voiding levels and increases process stability as well as thermal and electrical performance, even in the most demanding component applications.
BloombergNEF forecasts over 70% technology adoption for automotive safety electronic components by 2028. To deliver vital solder joint reliability in this use case, low-void solder pastes play a critical role. As well as this application, ALPHA OM-362 is recommended for improving board reliability in aerospace, consumer electronics, industrial, and LED lighting components.
With continuing miniaturization in electronic components for automotive, consumer, and industrial applications, ALPHA OM-362 will deliver on your low-voiding requirements.
Don’t just take our word for it. Reach out to us at www.macdermidalpha.com/contact-us and start your low-void solder paste conversation today.
Suggested Items
IMI Welcomes New CEO
05/03/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI),The IMI Board of Directors announced, in a disclosure dated April 25, 2024, the appointment of Louis Sylvester Hughes, Chief Executive Officer (CEO).
Benchmark Reports Q1 2024 Results
05/03/2024 | PRNewswireRevenue decreased quarter over quarter and year over year primarily due to decreases in Medical, Advanced Computing and Next-Generation Communication sales, which were partially offset by an increase in Complex Industrials sales quarter-over-quarter and increases in Semi-Cap and A&D sales year-over-year.
Ansys Announces Q1 Financial Results
05/03/2024 | ANSYSANSYS, Inc. reported first quarter 2024 revenue of $466.6 million, a decrease of 8% in reported and constant currency, when compared to the first quarter of 2023.
SCHMID Group Closes Business Combination, Begins Trading on NASDAQ
05/02/2024 | SCHMID GroupGebr. SCHMID GmbH, a global solutions provider for the high-tech electronic, photovoltaics, glass, and energy systems industries, and Pegasus Digital Mobility Acquisition Corp. announced the completion of their business combination.
Sanmina's Second Quarter Fiscal 2024 Financial Results
05/02/2024 | Sanmina Corp.Sanmina Corporation, a leading integrated manufacturing solutions company, today reported financial results for the fiscal second quarter ended March 30, 2024 and outlook for its fiscal third quarter ending June 29, 2024.