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Trouble in Your Tank: Those Problematic Soldermask Issues
I am sure you have heard the words, “It’s not rocket science.” Apologies to the rocket scientists. Sometimes PCB fabrication just makes it look that way. This month’s Trouble in Your Tank approaches the subject of soldermask adhesion using an actual case study. As the reader will note, I recommend using sound troubleshooting methodology to zero in on the root cause of the problem.
Problem Statement
A medium-sized U.S.-based PCB fabricator had started to experience adhesion failures of liquid photoimageable soldermask on select part numbers. The company utilizes a double-sided screen printing machine to apply the solder mask.
The fabricator claims that “nothing has changed” (I love that one). Read the full column here.
Editor's Note: This column originally appeared in the January 2013 issue of The PCB Magazine.
More Columns from Trouble in Your Tank
Trouble in Your Tank: Supporting IC Substrates and Advanced Packaging, Part 5Trouble in Your Tank: Electrodeposition of Copper, Part 6
Trouble in Your Tank: Electrolytic Copper Plating, Part 5
Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 4
Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 3
Trouble in Your Tank: Electrodeposition of Copper, Part 4—Addition Agents
Trouble in Your Tank: Lead-free and the Fabrication Challenge, Part 1
Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 2