Material Insight: The Dielectric Constant of PCB Materials
American Made Advocacy: What About the Rest of the Technology Stack?
It’s Only Common Sense: Great Ideas From John Mitchell’s Book on Hiring HabitsIPC Standards Committee Reports – Packaged Electronic Components, Flex Circuits, High Speed/High Frequency, Rigid Printed Boards
December 7, 2015 | IPCEstimated reading time: 4 minutes
Packaged Electronic Components
The B-11 3-D Electronic Packages Subcommittee continued work on IPC-7091, Design and Assembly Process Implementation of 3-D Components. There has been significant interest in this standard from both the military and commercial markets, and the subcommittee is ensuring groups doing similar work are included in the efforts for IPC-7091.
Flexible Circuits
The D-11 Flexible Circuits Design Subcommittee met to advance the Working Draft to IPC-2223D, Sectional Design Standard for Flexible Printed Boards. The group reviewed and approved new drawings depicting flexible cross-sectional construction examples and unbonded flex cross-sectional constructions for rigid-flex designs. The group also reviewed new content addressing the factors that affect impedance and capacitance control for flex and rigid-flex printed board applications so as to mitigate signal integrity issues.
The D-12 Flexible Circuits Performance Subcommittee met to advance the Working Draft to IPC-6013D, Qualification and Performance Specification for Flexible Printed Boards. The group also reviewed a cross-sectional illustrations that address voiding or delamination in the transition zone between flexible material and rigid material. The group also reviewed examples of anomalies in flexible printed board assemblies (e.g. kinks in the ribbon cable following assembly operations) and agreed to submit recommendations to the IPC 7-31b task group for addressing these issues in a future revision to IPC-A-610, Acceptability of Electronic Assemblies.
The D-13 Flexible Circuits Base Materials Subcommittee began review and updating of IPC-4202A to ultimately revise it to B revision.
The D-15 Flexible Circuits Test Methods Subcommittee began to review all flexible circuits test methods for relevance to all materials, printed boards and design standards. Most if not all test methods that apply to old flexible circuits (those that begin with “FC” are likely to be obsolete and will likely be archived.
Page 1 of 3
Share on:
Suggested Items
Würth Elektronik in United States Embarks on New Milestone with State-of-the-Art Headquarters
05/17/2024 | Wurth ElektronikWürth Elektronik in the United States, a leading manufacturer of electronic and electromechanical components as well as custom magnetics, has announced the commencement of construction on a new 70,000-square-foot headquarters. This new facility underscores the company’s commitment to innovation and grow in the electronics industry.
IPC APEX EXPO: Some Thoughts About Growth
05/16/2024 | Dan Feinberg, I-Connect007After two and a half days of wandering the aisles at IPC APEX EXPO 2024, for the first time, I almost felt like I was exploring CES. There were so many booths and exhibits that I could describe, but I’d like to focus on the growth and huge value of this event, which has expanded well beyond just the growing and impressive exhibit show floor.
Airbus Achieves Eurodrone’s Preliminary Design Review
05/16/2024 | AirbusThe Eurodrone programme has successfully performed the Preliminary Design Review (PDR). Led by Airbus Defence and Space as prime contractor, this major programme milestone has been completed with OCCAR and representatives of the four customer nations (France, Germany, Italy and Spain) in the presence of the three Major Sub-Contractors (MSC), Airbus Defence and Space Spain, Dassault Aviation and Leonardo.
A Review of the 2024 Del Mar Electronics and Manufacturing Show
05/16/2024 | Barry Matties, I-Connect007The Del Mar Electronics and Manufacturing Show (DMEMS) in Del Mar, California, recently took place at an unlikely venue: the Del Mar Fairgrounds. Doug Bodenstab, founder and show organizer, says the show covers everything in electronics manufacturing: design tools, components, base materials, training, testing, board fabrication, AI, data analytics, and more. While you can find about anything online these days, Bodenstab adds that there is no substitute for meeting people in person.
TactoTek Licenses IMSE Technology to Polestar for Sustainable Electronics Design Innovation
05/15/2024 | TactoTekPolestar, the Swedish electric performance car brand, and Finnish smart surface pioneer TactoTek, have entered a collaboration to explore integration of Injection Molded Structural Electronics (IMSE) technology into Polestar’s vehicle programs.