-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Rogers Offers Practical Insights into Testing and Using Advanced Circuit Materials at DesignCon 2016
January 6, 2016 | Rogers CorporationEstimated reading time: 3 minutes
Rogers Corporation will be exhibiting and educating at the upcoming DesignCon. Now in its 21st year, DesignCon is a premiere event for design chip-circuit-and system-level engineers working on high-frequency analog and high-speed digital circuits. DesignCon 2016 is scheduled for January 19-21, 2016 (January 20-21 for the exhibition) at the Santa Clara Convention Center (Santa Clara, California).
On the conference side, John Coonrod, Technical Marketing Manager for Rogers Advanced Connectivity Solutions, and author of the popular ROG Blog series, will participate in a 75-minute panel discussion targeting effective measurement methods for high-frequency/high-speed printed-circuit-board (PCB) materials.
This technical presentation will focus, in particular, on frequencies above 10 GHz, as needed for a growing number of applications, including many emerging wireless communications systems. Conducted by the IPC D-24c task group (www.ipc.org) on High Frequency Test Methods, the round-robin-style panel discussion (“Track 05: Characterize PCB Materials and Processing”) will explore the properties of some of the latest circuit materials and examine different methods for testing and characterizing those materials. Joining John Coonrod in the discussion will be Glenn Oliver, Senior Engineer at DuPont, and Don DeGroot, President of CCN.
Also, Dr. Allen F. Horn III will be presenting “Effect of conductor profile structure on propagation in transmission lines” at 9:20 AM on Thursday, January 21 and participating as a member of the August panel discussion “Getting smooth copper and keeping it” at 3:45 PM on Thursday, January 21.
As part of the DesignCon Expo Hall, representatives from Rogers Corp. (www.rogerscorp.com) will be exhibiting at Booth #702, with information and insight on the use of their circuit materials, including ULTRALAM® 3850HT, CLTE-XT™, and RO3003™ laminates. Rogers will also be previewing their new material system developed for ultra low loss digital applications.
ULTRALAM 3850HT high-temperature (HT) liquid-crystal-polymer (LCP) circuit material delivers high yields in multilayer circuits. Its high melt temperature of +330°C improves multilayer layer-to-layer registration and offers improved thermal stability, while its low effective dielectric constant (3.14 @10GHz), low loss (0.002), and thin core offerings make it an ideal circuit material for millimeter frequencies, including 77 GHz used in long range automotive collision-avoidance radar systems. Being highly impermeable, it is an attractive alternative to ceramic for MMIC (monolithic microwave integrated circuit) packaging.
Page 1 of 2
Suggested Items
MKS’ Atotech to Participate in ECTC
05/10/2024 | MKS’ AtotechAt this year’s 74th IEEE Electronic Components and Technology Conference (ECTC), MKS’ Atotech will present and demonstrate its latest product and service innovations.
The Chemical Connection: Reducing Etch System Water Usage, Part 2
05/02/2024 | Don Ball -- Column: The Chemical ConnectionIn my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.