-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
N.A. PCB Book-to-Bill Ratio Increases to 1.04 in January
March 2, 2016 | IPCEstimated reading time: 2 minutes
IPC — Association Connecting Electronics Industries announced today the January 2016 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Sales and orders slumped in January, but orders continued to outpace sales, bringing the book-to-bill ratio up to 1.04.
Total North American PCB shipments declined 1.6 percent in January 2016 compared to January 2015. Compared to December 2015, January 2015 shipments were down 19.2 percent.
PCB bookings fell 3.4 percent below the level of January 2015. Orders in January 2016 were down 14.3 percent from the previous month.
“Historically, January is a slow month for the PCB industry,” said Sharon Starr, IPC’s director of market research. “Although sales and orders in January were slightly below last year’s levels, orders continued to outpace sales, which brought the book-to-bill ratio back into positive territory. The ratio’s brief decline into negative territory near the end of last year is consistent with the current weak start to the new year,” she added, “but the return to positive ratios indicates the likelihood that slow growth will resume in 2016.”
Detailed Data Available
The next edition of IPC’s North American PCB Market Report, containing detailed January data from IPC’s PCB Statistical Program, will be available the first week in March. The monthly report presents detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, military and medical market growth, demand for prototypes, and other timely data. This report is available free to current participants in IPC’s PCB Statistical Program and by subscription to others. More information about this report can be found here.
Page 1 of 2
Suggested Items
Real Time with… IPC APEX EXPO 2024: The Success and Future of IPS's Vertical Technology
05/13/2024 | Real Time with...IPC APEX EXPOMike Brask reports on his experience at the show, telling us about the buzz surrounding the vertical technology offerings at IPS, and its benefits. He highlights their customer-centric approach, future growth strategies, and the challenges in workforce management. The conversation also touches upon their recruitment strategies and expresses optimism for the industry's future.
ASMC 2024 Opens With AI, Smart Manufacturing and Sustainability in Focus
05/13/2024 | SEMIThe 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024) opens today to focus on critical topics ranging from yield management and metrology to new developments in artificial intelligence, smart manufacturing and sustainability.
AEye Announces Partnership with Leading Automotive Electronics and Vision Solutions Provider, LITEON
05/13/2024 | BUSINESS WIREAEye, Inc., a global leader in adaptive, high-performance lidar solutions, today announced that the non-binding Letter of Intent (“LOI”) announced in March is with LITEON Technology Corporation and is intended to provide AEye with a customer channel and industrialization partnership.
DuPont Showcases AI Innovations Featuring Advanced Interconnects at 2024 International Electronic Circuits Exhibition
05/13/2024 | DuPontDuPont announced it will showcase its comprehensive range of advanced circuit materials and solutions at the 2024 International Electronic Circuits Exhibition in Shanghai. With a product portfolio that includes fine line, signal integrity, power and thermal management, DuPont will exhibit at Booth #8L06 at the National Exhibition and Convention Center (NECC) from May 13 to 15.
Korean Semiconductor Industry Titans Back DEEPX in Series C Funding Round
05/13/2024 | PRNewswireDEEPX, a prominent AI semiconductor technology startup under the leadership of CEO Lokwon Kim, is delighted to announce the successful conclusion of its Series C funding round, amassing $80.5M (KRW 110B).