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EIPC has announced that Thomas Hofmann of Hofmann Leiterplatten GmbH has received a prestigious Best Paper award at the 14th Electronic Circuits World Convention (WECC) held at the Korea International Exhibition & Convention Center (KINTEX) in Goyang City, South Korea in April 2017.
Hofmann's paper, "Sharing Experience in Embedding of Active and Passive Components in Organic PCBs for More Reliability and Miniaturization," received the award in the field of Application of Technology. Hofmann is a long-standing EIPC member and is to be congratulated for his highly informative and important contribution to the World Convention technical programme.
Look for this paper in the June issue of The PCB Magazine.
Kelsey Smith, All Flex
Many of the issues that arise when using a flex circuit come from a lack of knowledge about how to properly design one, especially when the circuit is required to bend. Many novices will design a circuit that calls for bending the flex in too tight of a bend radius, which can cause damage to the circuit and lower the reliability of the end product. This series of articles will focus on the seven key aspects to consider when designing for maximum durability and maximum “flexibility.”
In a recent interview, Kelly Dack and Tara Dunn (Omni PCB president and conference co-chair) discussed why designers need to attend the SMTA Additive Electronics Conference. Tara will also be attending and moderating a panel discussion at the conference.
Manuel Herrera, Ohmega Technologies, Inc.
There has been a growing adoption of NiP thin film resistors as heater elements from a diverse group of users including those in the aerospace, defense, high-end computing and the volume consumer electronics market. A novel application has now grown from the validation and reliability testing perspective. Using embedded resistors as heaters to do high-temperature or burn-in testing eliminates the need for thermal chambers.