EIPC SpeedNews: News from the European PCB Industry


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News from EIPC

- Interview Technical Director Tarja Rapala-Virtanen by Pete Starkey, PCB007 

News from Imaps 

- Call for abstract submission for MicroTech 2019

News from the USA

-  Greensource Fabrication LLC Announces Acquisition AWP Group GmbH 

News from the UK

- Ventec Extends tec speed 20.0 Series of Low PIM Antenna-Grade Laminates

News from WECC Members

Click here for the International Events Diary 2018-2019

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Suggested Items

2020 EIPC Winter Conference, Day 1

03/09/2020 | Pete Starkey, I-Connect007
Pete Starkey recaps how the 2020 EIPC Winter Conference, held in mid-February, attracted around 90 delegates from a dozen European countries—as well as a few from North America—to an outstanding learning and networking experience for members of the PCB community. The theme of this year's event was: “The Needs for Next-Generation Electronic Devices and Changes in Fabrication Solutions for PCBs, PCBAs, Materials, and Technologies.”

Ventec’s Materials are Enablers for 5G, Industry 4.0

02/26/2020 | I-Connect007 Editorial Team
In this video interview from the show, Technical Editor Pete Starkey and Ventec COO for Europe and the Americas Mark Goodwin discuss Ventec’s latest high-speed, low-loss, high-frequency materials as enablers for 5G and Industry 4.0.

Upcoming IPC APEX EXPO Offers Sessions on 5G

02/03/2020 | Nolan Johnson, PCB007
Dave Hoover of TTM discusses the Sessions @ the Intersection set for IPC APEX EXPO 2020—specifically, the two-part session he will host around the topic of 5G and materials.



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