ChipMOS Reports August 2019 Revenue
September 6, 2019 | PRNewswireEstimated reading time: Less than a minute
ChipMOS TECHNOLOGIES INC., an industry leading provider of outsourced semiconductor assembly and test services (OSAT), reported unaudited consolidated revenue for the month of August 2019.
Revenue for the month of August 2019 was NT$1,912.2 million or US$61.1 million, an increase of 10.1% from the month of July 2019 and an increase of 10.3% from the same period in 2018. This represents the highest revenue level since December 2014. The Company noted that it is benefiting from continued growth led by the addition of new NAND flash business, diversification of gold bumping for DDIC to wafer bumping of non-DDIC products, and a further rebound in TDDI demand entering typically stronger second half of the year.
About ChipMOS TECHNOLOGIES INC.
ChipMOS TECHNOLOGIES INC. is an industry leading provider of outsourced semiconductor assembly and test services. With advanced facilities in Hsinchu Science Park, Hsinchu Industrial Park and Southern Taiwan Science Park in Taiwan, ChipMOS provide assembly and test services to a broad range of customers, including leading fabless semiconductor companies, integrated device manufacturers and independent semiconductor foundries.
All U.S. dollar figures cited in this press release are based on the exchange rate of NT$31.32 to US$1.00 as of August 30, 2019.
Suggested Items
Reducing Nitrogen Consumption in Convection Soldering with Rehm Thermal Systems' Patented Mechatronic Curtain
03/28/2024 | Rehm Thermal SystemsCurrent developments indicate a need for larger throughput heights due to the trend towards e-mobility, which in turn increases nitrogen consumption for process inertization. Rehm Thermal Systems responds to this issue with an innovative solution: the mechatronic curtain.
Europlacer Announces Introductory Promotions for 2024 IPC APEX EXPO
03/27/2024 | EuroplacerEuroplacer, a leading provider of SMT assembly solutions, is excited to announce special introductory promotions for its latest products at the upcoming 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California.
ITW EAE Wins New Product Introduction Award for Electrovert® Wave Soldering Machine Deep Wave
03/26/2024 | ITW EAEITW EAE is proud to announce that it has earned a 2024 New Product Introduction (NPI) Award for Electrovert’s Deep Wave option for wave soldering machines. This new, innovative system provides the ability to pump up to a 20 mm wave height.
Green Circuits Unveils Innovative Stacked Capacitors Assembly Process
03/21/2024 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, today announced a groundbreaking advancement in process engineering with the successful implementation of an innovative assembly technique for stacked capacitors.
Mek's Next-Gen AOI Technology Takes Center Stage at IPC APEX EXPO 2024
03/19/2024 | MEKMek is excited to announce its presence at IPC APEX EXPO, North America's largest electronics manufacturing event, in Anaheim, California, from April 6-11, 2024. Attendees are invited to visit Mek at booth #1433 to explore the latest AOI technology offerings.