-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Mike Casper Appointed Group Applications Engineer at TAKAYA
February 25, 2020 | TakayaEstimated reading time: Less than a minute
Mike Casper has been appointed Group Applications Engineer for TAKAYA flying probe test systems by TEXMAC, the exclusive authorized distributor of TAKAYA flying probe test systems in North America. In his new position, Mike will be responsible for Pre-sales evaluations and Post-sales customer support including training, service, and applications. TAKAYA is the inventor and industry leader in flying-probe test technology for more than 25 years.
In making the announcement, Roy McKenzie, Takaya Group Manager for TEXMAC Inc., said, “Mike is a great asset to our customers thanks to his extensive experience in our industry. He spent 15 years in a very similar position with another flying probe test company providing customer support for flying probe and functional test applications. Prior to that Mike spent 20 years developing functional test hardware and software for a number of different companies and product types. He brings tremendous talent and experience to his new position. We’re pleased to welcome him to the TEXMAC team.”
Suggested Items
D Coupon Testing and Data Insights With GreenSource Fabrication
04/17/2024 | Marcy LaRont, PCB007 MagazineMarcy LaRont spoke with Steve Karas of GreenSource Fabrication at the SMTA UHDI conference in March. He presented a case study that GreenSource undertook with a customer on critical via reliability with advanced materials and used the experience to highlight the importance and effectiveness of D coupon testing. He also discussed GreenSource’s approach to data aggregation and a new system they developed to use collected data effectively.
Three Industry Leaders Receive IPC President’s Award
04/17/2024 | IPCIn recognition of their leadership and significant contributions of time and talent to IPC and the electronics industry, three IPC volunteers were presented with the IPC President’s Award at IPC APEX EXPO in Anaheim, Calif., on April 9, 2024.
Yamaha to Showcase Latest-generation Assembly Equipment and Software Tools at SMTconnect
04/16/2024 | Yamaha Robotics SMT SectionYamaha Robotics SMT Section will team with its distributor ANS Elektronik to showcase innovations for high-speed surface mount assembly at SMTconnect 2024.
TT Electronics Awarded Contract with Kongsberg Defence and Aerospace
04/11/2024 | TT ElectronicsTT Electronics, a leading provider of global manufacturing solutions and engineered technologies, announced today that its Fairford UK business has been awarded a new contract with long-standing customer Kongsberg Defence and Aerospace (Kongsberg) for the production of complex cable harness solutions.
Infineon, Amkor Deepen Partnership and Strengthen European Supply Chain for Semiconductor Solutions
04/10/2024 | InfineonInfineon Technologies AG, a leader in power systems and IoT, is strengthening its outsourced backend manufacturing footprint in Europe and announced a multi-year partnership with Amkor Technology, Inc., a leading provider of semiconductor packaging and test services.