AT&T and Brain Corp. are Meeting COVID-19 Challenges
April 8, 2020 | AT&T NewsroomEstimated reading time: 1 minute
AT&T* and Brain Corp are working together to support data-rich IoT applications for autonomous mobile robots as COVID-19 brings the value of automation sharply into focus.
Large-scale original equipment manufacturers are using Brain Corp technology to create autonomous robots that help retailers support workers and drive value by operating safely alongside workers and the general public. Through its OEM partners, Brain Corp has deployed or enabled approximately 10,000 automated floor scrubbers, vacuum sweepers, and delivery robots used by big-box retailers, grocery stores, airports and shopping malls across the U.S., Europe and Asia.
The addition of AT&T’s highly-secure cellular connectivity will provide Brain Corp’s cloud-enabled artificial intelligence platform with capabilities that will help retailers manage restocking and merchandising more efficiently.
“Freeing up time for workers so they can focus on important duties like cleaning high-contact surfaces, restocking, and assisting customers has never been more important,” said David Pinn, senior vice president of strategy for Brain Corp. “Our agreement with AT&T will enable Brain Corp to expand our robotic application portfolio for retailers and other businesses looking to adapt to today’s changing world.”
The COVID-19 crisis has highlighted the critical role that robotics can play in bringing accessible automation to businesses and their frontline workers. Brain Corp-powered robots can be deployed quickly without custom infrastructure or training, and are currently providing more than a quarter million autonomous hour per month for retailers and essential businesses.
“The health crisis is a clear example of how advanced technology and IoT solutions can radically improve the way we approach and solve societal challenges,” said Chris Penrose, senior vice president, Advanced Solutions, AT&T. “Working with Brain Corp shows how innovative technologies can be quickly deployed to meet urgent needs of those working in essential businesses and on the front lines.”
Suggested Items
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.
Standard Of Excellence: The Products of the Future
09/19/2023 | Anaya Vardya -- Column: Standard of ExcellenceIn my last column, I discussed cutting-edge innovations in printed circuit board technology, focusing on innovative trends in ultra HDI, embedded passives and components, green PCBs, and advanced substrate materials. This month, I’m following up with the products these new PCB technologies are destined for. Why do we need all these new technologies?
Experience ViTrox's State-of-the-Art Offerings at SMTA Guadalajara 2023 Presented by Sales Channel Partner—SMTo Engineering
09/18/2023 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is excited to announce that our trusted Sales Channel Partner (SCP) in Mexico, SMTo Engineering, S.A. de C.V., will be participating in SMTA Guadalajara Expo & Tech Forum. They will be exhibiting in Booth #911 from the 25th to the 26th of October 2023, at the Expo Guadalajara in Jalisco, Mexico.
Intel Unveils Industry-Leading Glass Substrates to Meet Demand for More Powerful Compute
09/18/2023 | IntelIntel announced one of the industry’s first glass substrates for next-generation advanced packaging, planned for the latter part of this decade.