CHASM Advanced Materials Extends Product Line Versatility with UV-Cure Variant

Reading time ( words)

CHASM Advanced Materials, Inc. has announced the immediate availability of a new UV-curable ink option extending the versatility of their patented AgeNT product line for transparent conductive printed electronics. The new VC210 UV-cure ink simplifies manufacturing processes and increases manufacturing yield for any transparent printed electronics application requiring robustness to handling during manufacturing or cleaning with chemical solvents during assembly such as touch screens. The new VC210 formulation also enables tighter control of precision features such as those found in the neck areas of touch circuits.

“Our partner network features some of the world’s preeminent experts in printed electronics fabrication continually developing next generation devices across a variety of industries,” said David J. Arthur, CEO and Co-Founder, CHASM Advanced Materials, Inc. “Working closely with them, development of VC210 benefited from their real-time and direct feedback on critical technical and market needs for exacting transparent printed electronics applications. VC210 has not only helped them reliably deliver innovative products to their customers but also in a way that is better for their bottom line.”

Complementary to CHASM’s initial VC200 ink, VC210 can be used with any Silver Nanowire (AgNW) substrate in CHASM’s CNT Hybrid platform of AgeNT 10, AgeNT 30 or AgeNT 75 to manufacture transparent heaters, touch screens or touch button applications for use in high heat or humidity environments or those needing precise control of fine features. Examples include automotive touch buttons or heated HMI controls for industrial equipment used outdoors.

Processing of VC210 follows a familiar workflow to VC200 series inks with an initial thermal cure followed by a UV pass so partners already experienced fabricating transparent conductive electronics with AgeNT come quickly up to speed on the new ink with little to no learning curve.


Suggested Items

Documenting Your Flex Circuit Design

09/16/2020 | Tony Plemel, Flexible Circuit Technologies
As a flex circuit applications engineer, when I receive an RFQ, the first thing I do is look at the customer’s data and review their manufacturing notes. Quite often, I find notes that supersede IPC specifications in manufacturing documents, as customers often believe these added notes and associated specifications will make the circuit more robust. However, these non-standard IPC manufacturing specifications/notes can wreak havoc on the manufacturing process and can actually lead to a less robust circuit.

Dale Smith and David Moody: Lenthor Pushing Limits of Flex Technology

07/21/2020 | Andy Shaughnessy, Design007 Magazine
Andy Shaughnessy recently spoke with Dale Smith and David Moody of Lenthor Engineering. Dale is Lenthor’s new chief technology officer, and David is the director of sales/marketing.

MFLEX Increases Growth

04/24/2020 | Happy Holden, I-Connect007
Happy Holden recently spoke with Jay Desai of MFLEX about the latest flex work the company has been doing and its aim to transition toward more automation and a smart factory approach.

Copyright © 2022 I-Connect007. All rights reserved.