L3Harris Technologies Wins Next Phase of Missile Defense Contract
February 2, 2021 | Business WireEstimated reading time: 1 minute
L3Harris Technologies was awarded a $121 million U.S. Missile Defense Agency contract to build space flight hardware to demonstrate the company’s solution for the Hypersonic and Ballistic Tracking Space Sensor (HBTSS) program.
“Our near-peer adversaries are making rapid advancements in missile technologies, posing a threat to our forward-deployed forces, allies and nation,” said Ed Zoiss, President, L3Harris Space and Airborne Systems. “L3Harris is leveraging our long-standing expertise in infrared remote sensing, advanced processing and communications, in addition to our recent wins in responsive space missions, to enable the Missile Defense Agency to quickly field significantly more capable and cost-effective mission solutions to address these threats.”
HBTSS is one of several proposed missions within the Department of Defense’s next-generation proliferated low-Earth orbit space architecture. The program’s objective is to detect and track traditional and emerging missile threats using infrared sensors and advanced processing capability.
The Missile Defense Agency awarded L3Harris a study contract in 2019 as the prior phase in this development program. L3Harris has also been competitively selected for two other layers of the missile warning and defense architecture. In December 2020, the Space Development Agency selected L3Harris to build and launch four space vehicles to detect and track ballistic and hypersonic missiles for launch in 2022. In April 2019, the U.S. Air Force selected L3Harris to design prototype payload and mission concepts for what has evolved into the U.S. Space Force’s medium-Earth orbit track custody demonstration.
Suggested Items
Northrop Grumman honors Calumet Electronics with Supplier Excellence Award
04/17/2024 | Calumet ElectronicsNorthrop Grumman Corporation has recognized Calumet Electronics during the company’s 2024 Supplier Excellence Awards for “exceptional performance and unwavering commitment to delivering with excellence.” Calumet is one of 70 suppliers recognized from across the globe. In its award category of “Supplier Strategic Excellence,” Calumet was honored alongside global corporations such as Amazon Web Services, Dell Technologies, and Eaton Corporation.
Ansys Joins BAE Systems’ Mission Advantage Program to Advance Digital Engineering Across US Department of Defense
04/16/2024 | ANSYSAnsys announced it is working with BAE Systems, Inc., to accelerate the adoption of digital engineering and MBSE across the Department of Defense (DoD).
IMAPS & IPC to Host Onshoring Workshop
04/16/2024 | IPCThe International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.
Lockheed Martin Boosts Domestic Microelectronics Capabilities for Pentagon Aerial Defense Program
04/08/2024 | Lockheed MartinLockheed Martin will work with Intel Corporation, and Altera, an Intel Company, to support the Stimulating Transition for Advanced Microelectronics Packaging (STAMP) program for the Office of the Under Secretary of Defense for Research and Engineering (OUSD R&E).
Northrop Grumman’s Integrated Battle Command System Demonstrates Another Successful LTAMDS and Patriot Live-Fire Integration
04/08/2024 | Northrop GrummanNorthrop Grumman Corporation’s Integrated Battle Command System (IBCS) seamlessly fused data from a Lower Tier Air and Missile Defense Sensor (LTAMDS) to acquire, track, engage and intercept a long-range cruise missile surrogate with a PAC-3 Missile Segment Enhancement during a recent test event held at White Sands Missile Range in New Mexico.