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In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
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One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
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New I-007eBook Highlights SMT Inspection: Today, Tomorrow, and Beyond
March 11, 2021 | I-Connect007Estimated reading time: 1 minute
Increasing board complexity is driving the need for accurate and speedy inspection systems. In The Printed Circuit Assembler’s Guide to SMT Inspection: Today, Tomorrow, and Beyond, author Brent Fischthal takes readers through a brief history of SMT inspection before discussing the benefits of data-driven analytics and how intelligent software solutions can help companies analyze and optimize the production process.
In this latest title from I-007eBooks, readers will learn how artificial intelligence has demonstrated promising potential in this field and has far-reaching applications within the manufacturing sector.
According to Michael Ford, Senior Director of Emerging Industry Strategy for Aegis Software, “This book provides unprecedented visibility of SMT processes, asserting inspection technology as a key active contributor to zero-defect quality initiatives, rather than being limited to simple defect detection.”
Download your free copy today!
You can also view other titles in our full library. The Printed Circuit Assembler’s Guide to… series is specifically dedicated to educating the printed circuit board assembly (PCBA) sector and serves as a valuable resource for people seeking the most relevant information available.
We hope you enjoy The Printed Circuit Assembler’s Guide to… SMT Inspection: Today, Tomorrow, and Beyond.
For more information, contact:
Barb Hockaday
I-Connect007 eBooks
barb@iconnect007.com
+1-916-365-1727 (GMT-8)
Suggested Items
Real Time with…. IPC APEX EXPO 2024: Innovation and Collaboration at EPTAC
05/06/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and EPTAC Vice President Leo Lambert discuss the partnership between EPTAC and Blackfox, their program alignment, and future expansion plans. Leo introduces Burak Gokmen as the new "leader of the pack." The focus then shifts to Nano Dimensions' 3D printed circuit boards, emphasizing the need for proper documentation and training.
The New Industry: Will the Growth Continue?
04/30/2024 | I-Connect007 Editorial TeamHow sustainable are the primary financial models in the United States regarding PCB fabrication shops? In this interview with economic experts Shawn DuBravac and Tom Kastner, we explore what’s happening with U.S. printed circuit board shops in today’s market, how consolidation affects the industry, and what can be done.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Determining the Value-add of Box Build
04/24/2024 | Nolan Johnson, I-Connect007At a strategic level, adding box-building services makes sense for customer loyalty. But is it really that simple? Jon Schmitz, who manages customer engagement at RiverSide Integrated Solutions, talk about about what it really takes to be successful in offering EMS and final assembly services under the same company banner.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.