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Jack Pattie, CEO of Ventec USA, discusses the company's newest laminate facility, which recently opened in Northern California. He explains how this location, the company's fourth, will help Ventec better serve customers in that region.
To watch this video, click here.
Shrinking Silicon, EMI, and SI
03/03/2023 | Andy Shaughnessy, Design007 Magazine
Dr. Todd Hubing is a longtime EMC instructor, president of LearnEMC, and a professor emeritus of the Electrical and Computer Engineering program at Clemson University. I asked Todd to discuss the challenges that shrinking silicon can present for traditional PCB designers, as well as the opportunities and benefits of smaller chip features.
Six Money-saving Material Properties When Designing PCB Stackups
03/13/2023 | Patrick Hope, Siemens Digital Industry Software, Sponsored Content
Stackup decisions are critical to every PCB and electronic product, but they don’t always get the attention they deserve. With better stackup planning focusing on six key parameters, designers can select the best materials early in the design process and minimize the risk of under- and overdesigning their PCB.
Everyone Wants Change: Who Wants to Lead the Way?
01/25/2023 | Nolan Johnson, I-Connect007
Nolan Johnson recently met with Alun Morgan, technology ambassador at Ventec, and Ventec COO Mark Goodwin to discusses the industry’s determination to cling to outdated processes and standards, and some potential consequences. To maintain efficiency and keep pace with the market’s newest entries in Asia, Alun and Mark believe that legacy companies in the West must be open to challenging conversations that will require questioning old practices and revising those practices toward sustainability.