Cirexx Develops ECLIPS Demonstration Module


Reading time ( words)

Cirexx International announced today that they have developed a module to demonstrate their ECLIPS technology. ECLIPS (Embedded Cooling Layer – Integrated Power System) is a system of producing high-power RF/microwave Printed Circuit Boards (PCBs) employing an embedded thermally engineered metalized heat-sink layer which has superior thermal conductivity characteristics and a very low-CTE.

The Cirexx ECLIPS technology serves as an alternative to co-fired ceramics and hybrid integrated circuits. The item is essentially a common Printed Circuit Board, made from otherwise typical RF/microwave Printed Circuit Board materials and processes. But with a high thermal conductivity and very low CTE the user can mount very fine pitch devices and in fact direct attach/wire-bond bare die such as GaN and GaAs. The other electronic components on the board can be standard “plastic parts” attached in a standard process such as a vapor phase soldering. This combination results in an electronic board system that is smaller, lighter weight, easier to make revisions to and certainly much less costly than the ceramic hybrid, all-die alternative.

The demonstration module allows Cirexx Application Engineers to demonstrate the technology at customer facilities and/or during ECLIPS presentations. With the use of common lab equipment the module demonstrates the efficient evacuation of heat generated by 2 bare die amplifiers and its effect on the power output. Cirexx President and CEO Philipp Menges said, “This Demo Module is another tool available to help our customers understand and evaluate the ECLIPS technology.”

About Cirexx International

Founded in 1980, Cirexx International, Inc. is an electronic solutions company offering PCB Design, PCB Fabrication and PCB Assembly of high-reliability Printed Circuit Boards, RF/Microwave Circuit Boards, Flexible Printed Circuits and Rigid-Flex Circuit Boards. Recognized as a time-technology leader, the company offers a genuine Quick Turn service and provides a one stop shop and all in-house solution known as Seamless Integration. Cirexx has expertise fabricating high layer count Printed Circuit Boards using a variety of substrates including a wide array of high-frequency RF-based materials in mixed (hybrid) constructions. Cirexx delivers unsurpassed quality and support to a large array of customers in the high-reliability markets of defense/aerospace, industrial, and medical instrumentation.

Share

Print


Suggested Items

PCB Technologies Expands Capabilities

04/16/2021 | Nolan Johnson, I-Connect007
Nolan Johnson speaks with Arik Einhorn and Yaad Eliya of Israel-based PCB Technologies about how they’ve increased their capabilities down to 1 mil line and space to better support their customers from the military, aerospace, and medical markets.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

03/26/2021 | Andy Shaughnessy, Design007 Magazine
This week, we have a round-up of stories from around the industry, including a Real Time with… IPC APEX EXPO interview with Ventec, an article by Tamara Jovanovic about eliminating “garbage in, garbage out,” a review of an EIPC webinar by Pete Starkey, and news about another trade show going virtual this summer. And last but certainly not least, we bring you our one-minute video salute to all the fantastic people in this industry who we’ve worked with for decades. Enjoy!

Bonding Hybrid Multilayer Constructions at Rogers Corporation

03/10/2021 | Real Time with...IPC
John Ekis, Rogers Corporation's market segment director for aerospace and defense, discusses the SpeedWave family of low-dielectric constant, ultra-low-loss prepreg materials with excellent filling and bonding characteristics for hybrid multilayer constructions. SpeedWave prepreg is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing. SpeedWave is available in multiple spread and open weave glass style and resin content combinations, and is also compatible with FR-4 fabrication processes and lead-free PCB assembly processing.



Copyright © 2021 I-Connect007. All rights reserved.