Last Call to Register for 2016 Environmental Compliance Conference


Reading time ( words)

It's a continuing challenge to stay current on global environmental regulations and issues such as EU RoHS exemption requests, China RoHS, EU REACH and the EU Circular Economy Strategy.

That is why IPC and ITI are again joining forces to help keep you ahead of the curve with the 2016 Conference on Emerging & Critical Environmental Product Regulations. This year's conference is your opportunity to hear expert insights on the recent EU Court of Justice decision on the definition of "article" and its impact on EU REACH, new developments for the EU RoHS exemption requests, and the recast and use changes to China RoHS.

The conference will feature compelling keynote presentations from well-known United Kingdom (UK) regulators Steve Andrews, of the UK Department for Environment, Food & Rural Affairs; and Dave Symons, of the Department for Business, Innovation & Skills and the Department for Energy and Climate Change.

An expert panel of electronic supply chain members and professionals will also discuss alternatives assessment — including the positive or negative impacts of substituting materials in products — and how to manage materials deselection based on assessments. Panelists include, by location:

  • Boston: Pam Eliason, TURI; Martha Coopersmith Gray, Ampehnol TCS; Stephen Greene, EMC Corporation
  • Chicago: Dr. John Howarter, Purdue University; Haim Eliyahu, Molex Inc.; Bill Olson, Seagate Technology
  • Silicon Valley: Corrine Holmes, Microsoft Corporation; John Katz, EPA Region 9; Neil Smith, Isola Group SARL

This conference will provide anyone who is responsible for keeping their organization in compliance with environmental regulations the tools they need to comply with legal, regulatory, and customer requirements.

For more information, click here.

Share

Print


Suggested Items

Future of 'Substances and Materials in Products' Data Exchange Formats as Standards

10/16/2019 | Jean-Pierre Theret, Dassault Systèmes
This article provides a simplified, state-of-the-art description of the data exchange formats for standards covering substances and materials reporting in products and processes. It also reviews existing issues and new challenges shared with end users of the standards and companies represented by their trade associations with some solution proposals they could discuss.

Decreasing Bend Radius and Improving Reliability—Part I

10/11/2019 | Kelsey Smith, All Flex
Many of the issues that arise when using a flex circuit come from a lack of knowledge about how to properly design one, especially when the circuit is required to bend.

Communication, Part 2: Design Data Packages

10/11/2019 | Steve Williams, The Right Approach Consulting LLC
The first part of this six-part series highlighted ways that PCB fabricators and designers can better communicate, starting with how to qualify a board shop. In Part 2, Bob Chandler and Mark Thompson talk about the importance of preparing, sending, and receiving comprehensive (and ideally, perfectly complete) design data packages.



Copyright © 2019 I-Connect007. All rights reserved.