OUR COLUMNISTS


Luca Gautero

Luca Gautero, SÜSS MicroTec

Exploring the many opportunities and challenges offered by inkjet as an advanced method of solder mask application.

Latest Column: Additive Reality: Drop It, and Enjoy the Greenback


Chris Young

Chris Young, Young Engineering Services

Lighthearted (sometimes humorous) and informative view on the aerospace and defense industry.

 

Latest Column: Adventures in Engineering: A Penny Primer on PCB Design Fundamentals


Team Cadence

Team Cadence, Cadence

Enabling shorter, more predictable PCB design cycles with better integration of component design and system-level simulation.

 

Latest Column: All Systems Go: Auto-Detecting Over- and Under-Derated Parts


Travis Kelly

Travis Kelly, PCBAA

This column will cover the support and growth of U.S. domestic printed circuit board (PCB) manufacturers and suppliers as they contribute to national security.

Latest Column: American Made Advocacy: The CHIPS Act is Just the Beginning


Marc Carter

Marc Carter, Aeromarc LLC

This is a series of columns or articles based on a course at Michigan Tech on PCB design, manufacturing, and assembly.

Latest Column: Better to Light a Candle: Chapter 12—Light at the End of the COVID Tunnel


Barry Olney

Barry Olney, In-Circuit Design Pty. Ltd.

Barry focuses on advanced PCB design, signal integrity, and EMC design techniques.

Latest Column: Beyond Design: Routing Strategies to Minimize Radiation


Kim O'Neil

Kim O'Neil, Prototron Circuits

Kim discusses the daily challenges of running an American PCB fabricaton facility.

Latest Column: Circuit Chronicles: It’s All About the Team


Matt Stevenson

Matt Stevenson, Sunstone Circuits

Matt Stevenson covers solutions to help your PCB projects succeed.

Latest Column: Connect the Dots: The ABCs of Clean Schematics


John Talbot

John Talbot, Tramonto Circuits

John focuses on flex and rigid-flex PCB and PCBA technologies, as well as various global business, technical, and market aspects.

Latest Column: Consider This: Designing Via-in-pad for Higher-Density Flexible Circuits


Dan Beaulieu

Dan Beaulieu, DB Management

Dan Beaulieu reviews new and classic books on succeeding in business.

Latest Column: Dan’s Biz Bookshelf: 'Real Change Now—Company Change Mastery'


Dana Korf

Dana Korf, Korf Consultancy LLC

Dana's columns focus on IPC-2581 as well as PCB front-end tooling, data quality, DFM processes, etc.

Latest Column: Dana on Data: My Holiday Season Data Wishlist


Dennis Fritz

Dennis Fritz, Fritz Consulting

Dennis covers military and defense industry topics and applications.

Latest Column: Defense Speak Interpreted: Who Won the Project Convergence War Game—Evil Chaos or JADC2?


Patrick Crawford

Patrick Crawford, IPC

Patrick Crawford provides updates on IPC Design activities.

Latest Column: Design Circuit: Green Ambition for the Electronics Manufacturing Industry


Vern Solberg

Vern Solberg, Consulting

This column will focus on technical issues related to PCB and Flex circuit design, etc.

 

Latest Column: Designers Notebook: Ultra High-Density Circuit Board Design


Team Siemens

Team Siemens, Siemens Digital Industries Software

Siemens explores the digital thread from concept to manufacturing.

Latest Column: Digital Transformation: Unblocking Innovation With a Component Digital Thread


John Watson

John Watson, Altium

John Watson covers a variety of tips that designers need to know.

Latest Column: Elementary, Mr. Watson: Is Your Bathroom in the Kitchen?


Dominique Numakura

Dominique Numakura, DKN Research

Dominique Numakura offers weekly updates on the PCB industry in Japan, from M&A activity to technological breakthroughs.

Latest Column: EPTE Newsletter: Travel to Japan During COVID


Dan Feinberg

Dan Feinberg, FeinLine Associates, Inc.

End-user technology and special features on end-user high technology products.

Latest Column: Fein-Lines: CES 2023—The Focus Is Becoming Clear


Joe Fjelstad

Joe Fjelstad, Verdant Electronics

As author of the Flexible Circuit Technology books, Joe covers everything to do with flexible interconnections in this column.

Latest Column: Flexible Thinking: The Chameleon of Interconnection Technologies


IPC Education Foundation

IPC Education Foundation, IPC

IPC Education Foundation updates on programs and activities.

Latest Column: Foundations of the Future: The Ins and Outs of a Student Chapter


Team NCAB

Team NCAB, NCAB Group

A variety of field application engineers from NCAB Group's technical team explore fresh PCB concepts.

Latest Column: Fresh PCB Concepts: Copper Coin for Dissipating Heat


Happy Holden

Happy Holden, I-Connect007

Happy will endeavor to catch our readers up on the latest technologies developed around the world since Karl Dietz retired this column in 2016.

Latest Column: Happy’s Tech Talk #13: Direct Imaging Revisited


Christine Davis

Christine Davis, EMS Specialist

Christine shares lessons learned from 20 years running her own company.

Latest Column: Her Voice: The Intractable Ceiling


Dan Beaulieu

Dan Beaulieu, DB Management

This weekly column is focused on helping electronics companies enhance their professional and technical image through sales and marketing, and, of course, common sense.

Latest Column: It’s Only Common Sense: A ‘Hire’ Responsibility—The Search


Bob Wettermann

Bob Wettermann, BEST, Inc.

Bob Wettermann looks at the challenges in rework and repair, and provides strategies in addressing them.

Latest Column: Knocking Down the Bone Pile: Opening a Trace on the Surface of a PCB


Marc Ladle

Marc Ladle, Viking Test Ltd.

Marc’s columns deal with various aspects of PCB production, focusing especially on troubleshooting production problems.

Latest Column: Ladle on Manufacturing: LED UV Cure—Does It Really Work?


Zac Elliott

Zac Elliott, Siemens Digital Industries Software

Zac Elliott offers PCBA manufacturers advice on Lean manufacturing with a focus on ROI and customers' stories.

 

Latest Column: Lean Digital Thread: The Manufacturing Metaverse Revisited


John Coonrod

John Coonrod, Rogers Corporation

John Coonrod offers PCB designers advice on modern laminates, with a focus on high-speed substrates.

Latest Column: Lightning Speed Laminates: Thermal Management Isn’t Getting Easier


Ronald C. Lasky

Ronald C. Lasky, Indium Corporation

Continuous improvement and education in SMT assembly.

Latest Column: Maggie Benson’s Journey: Melancholy Endings and Exciting Beginnings


Clive

Clive "Max" Maxfield, Clive Maxfield High-Tech Consulting

Max focuses on EDA tools, PCB design techniques, and innovative technologies of the past, present, and future.

Latest Column: Maxed Out: Component Search Engine is a Total Game Changer


Doug Sober

Doug Sober, Essex Technologies Group

Doug writes about the problems of & concerns with PCB laminate materials and their specifications.

 

Latest Column: Mr. Laminate Tells All: Is Your Laminate and Prepreg Supplier Cheating? Only One Way to Find Out


Nolan Johnson

Nolan Johnson, I-Connect007

Nolan brings 30 years of career experience focused almost entirely on electronics design and manufacturing.

Latest Column: Nolan’s Notes: UHDI—Raising Awareness and Interesting Questions


John Mitchell

John Mitchell, IPC

John will cover issues affecting the entire global electronics industry supply chain.

Latest Column: One World, One Industry: Opportunities in India for Electronics Manufacturing


Alfred Macha

Alfred Macha, AMT Partners

Alfred will provide insight into topics, including process validation, operational excellence, supply chain management, quality management systems, government contracts, FDA regulations, process controls, and more.

Latest Column: Operational Excellence: Strengthen Your Design Transfer Process With Agile NPI


Tara Dunn

Tara Dunn, Averatek

When it comes to additive circuits, Tara really knows what she is talking about!

Latest Column: PCB Talk: Is DWM Just Another Buzzword?


Duane Benson

Duane Benson, Screaming Circuits

Duane offers tips and tricks for PCB assembly issues.

Latest Column: Powerful Prototypes: Small Computer Modules


Tom Kastner

Tom Kastner, GP Ventures, Ltd.

'Punching Out' is a series of articles on mergers and acquisitions in the PCB and assembly sectors.

Latest Column: Punching Out: Breaking Out of the Box


Istvan Novak

Istvan Novak, Samtec

Focusing on signal and power integrity issues related to PCB design and design engineering.

Latest Column: Quiet Power: Noise Mitigation in Power Planes


Team Electrolube

Team Electrolube, Electrolube

Team Electrolube illustrates the best PCB design practices for optimizing the conformal coating process.

Latest Column: Sensible Design: Encapsulation Resins—PU vs. Epoxy


Michael Ford

Michael Ford, Aegis Software

Michael writes about the Industrial Internet of Manufacturing (IIoT), Industry 4.0 and smart factories, and how these technologies are accelerating the electronics manufacturing industry.

Latest Column: Smart Factory Insights: Clinging to Best Practices in Worst-case Scenarios


Dr. Jennie Hwang

Dr. Jennie Hwang, H-Technologies Group

As an internationally recognized SMT authority, Dr. Hwang offers her perspective on a range of technical and process issues.

Latest Column: SMT Perspectives and Prospects: Cybersecurity Requires an Active Approach


Ray Prasad

Ray Prasad, Ray Prasad Consulting

Ray writes about reducing costs - improving yields - and increasing reliability.

Latest Column: SMT Solver: Flux and Cleaning—How Clean Is Clean? Part 2


Anaya Vardya

Anaya Vardya, American Standard Circuits

This column strives to make all facets of printed circuit board technology clear and easy to understand.

Latest Column: Standard of Excellence: The Power of Partnerships


Kelly Dack

Kelly Dack, EPTAC Corporation

Kelly’s column pursues the need for stakeholder advocacy in the printed circuit industry head-on, deliberating topics essential for helping one another achieve 100% acceptability in PCB engineering, design, procurement, sales, manufacturing, test and inspection.

Latest Column: Target Condition: Scaling PCB Design to the Power of 10


Todd Kolmodin

Todd Kolmodin, Gardien Services, USA

Todd covers a range of electrical test and reliability issues.

Latest Column: Testing Todd: Induction Junction, What’s Your Function?


Mark Thompson

Mark Thompson, Out of the Box Manufacturing

Mark Thompson discusses PCB design from a fabricator's viewpoint, with a focus on DFM issues.

Latest Column: The Bare (Board) Truth: My Top Six Design Challenges


Mehul Davé

Mehul Davé, Entelechy Global and Linkage Technologies

Mehul's column explores benefits for outsourcing CAM engineering.

Latest Column: The Big Picture: The Virtual Via Drum


Christopher Bonsell

Christopher Bonsell, Chemcut

Discussions about topics concerning wet processes, wet processing equipment, and how changes in these areas can improve the PCB industry.

Latest Column: The Chemical Connection: Closing the Innovation Gap


Mike Buetow

Mike Buetow, Printed Circuit Engineering Association

This column is dedicated to providing news about PCB design classes and events, as well as helping engineers, designers, and anyone related to printed circuit design from around the globe to network and share information.

Latest Column: The Digital Layout: A Different Kind of Additive Manufacturing


Chris Mitchell

Chris Mitchell, IPC

In this column, IPC VP of Global Government Affairs Chris Mitchell and his team provide news and views on government policies that affect the electronics industry and its supply chain.

Latest Column: The Government Circuit: Time to Advocate for Critical PCB Legislation


Chris Ellis

Chris Ellis, Manncorp Inc.

Chris will address common problems that Manncorp customers have had with the in-house conversion process and share solutions that have worked in the past.

Latest Column: The Mannifest:Tips for Today's SMT Challenges


Hannah Nelson & Paige Fiet

Hannah Nelson & Paige Fiet, IPC Student Directors

Two up and coming engineers discuss the bridge between electronics education and the electronics industry.

Latest Column: The New Chapter: Retaining Engineers in the Workplace


Team Elmatica

Team Elmatica, Elmatica

The PCB Norsemen from Elmatica share their knowledge, experience, technical advice, and thoughts about the fascinating world of PCBs.

Latest Column: The PCB Norsemen: Holy Cow, What a Lead Time


George Milad

George Milad, Uyemura International Corporation

George's columns cover PCB plating, IPC specifications, and more

Latest Column: The Plating Forum: Surface Finish Evolution from Conventional to Advanced


Martyn Gaudion

Martyn Gaudion, Polar Instruments

In his column, Martyn discusses signal integrity and impedance design test.

Latest Column: The Pulse: Fitting Physics to Fact


Steve Williams

Steve Williams, The Right Approach Consulting

A no-nonsense view of manufacturing and management strategies from one of electronic manufacturing's top authorities.

Latest Column: The Right Approach: Leadership 101: The Law of Explosive Growth


Andy Shaughnessy

Andy Shaughnessy, I-Connect007

Andy Shaughnessy discusses topics that are important to the community of PCB designers and design engineers.

Latest Column: The Shaughnessy Report: It’s All About the Physics—or Is It?


Tim Haag

Tim Haag, First Page Sage

Tim Haag discusses PCB design topics from his viewpoint as an EDA technologist and longtime board designer.

Latest Column: Tim’s Takeaways: What More Do We Need to Know?


Imran Valiani

Imran Valiani, RUSH PCB Inc.

Imran Valiani addresses ways to get products to market as quickly as possible.

Latest Column: Time to Market: Ten Ways to Bring Your Product to Market


Michael Carano

Michael Carano, Averatek

A comprehensive look at plating, metallization processes and PWB fabrication techniques.

Latest Column: Trouble in Your Tank: Success in Photolithography Starts With Surface Preparation


Bill Cardoso

Bill Cardoso, Creative Electron

Dr. Cardoso will cover everything related to X-rays from cool historical facts to the latest in technological advancements.

Latest Column: X-Rayted Files: Battery-Powered Advancements Keep on Ticking


Zulki Khan

Zulki Khan, NexLogic Technologies, Inc.

Zulki Khan talks about new frontiers in upcoming manufacturing techniques, including challenges in the marriage of SMT and microelectronics manufacturing and the critical aspects involved.

Latest Column: Zulki's PCB Nuggets: Cleanliness is Next to Reliability


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