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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/03/2024 | Nolan Johnson, I-Connect007
This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, alongside reports from SEMI, USPAE, and EIPC, we simply had to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.

IMI Welcomes New CEO

05/03/2024 | IMI
Integrated Micro-Electronics, Inc. (IMI),The IMI Board of Directors announced, in a disclosure dated April 25, 2024, the appointment of Louis Sylvester Hughes, Chief Executive Officer (CEO).

Gstar Announced the Strategic Move: Groundbreaking of Silicon Wafer Factory Construction in Indonesia

05/03/2024 | PRNewswire
Recently, Gstar held a groundbreaking ceremony for its silicon rod and silicon wafer factory, marking the beginning of the rapid construction phase.

ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series

05/01/2024 | ZESTRON
ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.

On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers

05/02/2024 | I-Connect007
In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback. 
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