Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

LPKF is Ready for Increasing Demand for Glass Substrates in the Semiconductor Industry

05/13/2024 | LPKF
The semiconductor industry is shifting towards glass to package the most advanced semiconductor chips. LPKF’s mature LIDE technology is enabling that transition into this new era from ramp-up to high volume manufacturing.

Redwire Announces Development of New European-Built Very Low Earth Orbit (VLEO) Spacecraft Platform called Phantom

05/13/2024 | BUSINESS WIRE
Redwire Corporation, a leader in space infrastructure for the next generation space economy, announced Phantom, a new European Very Low Earth Orbit (VLEO) spacecraft platform.

iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging

05/13/2024 | iNEMI
Advanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling.

Schweizer Receives Future Prize from Ewald Marquardt Private Foundation for p² Pack Embedding Technology

05/10/2024 | Schweizer Electronic AG
As the number of electric vehicles increases, so do the demands on electrical power management in vehicles. To make power generation and engine operation more efficient, Schweizer Electronic AG's p² Pack technology offers a long-term and sustainable solution to better convert and even recover the energy generated.

MKS’ Atotech to Participate in ECTC

05/10/2024 | MKS’ Atotech
At this year’s 74th IEEE Electronic Components and Technology Conference (ECTC), MKS’ Atotech will present and demonstrate its latest product and service innovations.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in