SEMI Announces Election of Two New International Board Members
December 13, 2023 | SEMIEstimated reading time: 1 minute
SEMI, the industry association serving the global electronics design and manufacturing supply chain, announced the election of two new members to the SEMI International Board: Kai Beckmann, Member of the Executive Board and CEO of the Electronics business sector of Merck KGaA, Darmstadt, Germany, and Benjamin Loh, Chair of the Management Board and President and CEO of ASM. The tenure of the new board members begins immediately.
“We congratulate the newly elected International Board members, Kai Beckmann and Benjamin Loh, and thank them for their commitment to guide SEMI in representing the global electronics manufacturing and design supply chain,” said SEMI President and CEO Ajit Manocha. “Kai and Benjamin add to the breadth and depth of knowledge on our Board of Directors and will help us to ensure that SEMI programs continue to advance semiconductor industry growth, address top concerns, and deliver exceptional member value.”
SEMI’s 18 independent voting directors and 11 emeritus directors represent companies from Europe, China, Japan, Korea, North America, and Taiwan, reflecting the global scope of the association’s activities. SEMI directors are elected by the general membership as voting members of the Board and can serve a total of five three-year terms.
Kai Beckmann joined the Executive Board of Merck KGaA, Darmstadt, Germany in April 2011. He has served as CEO of the Electronics business sector since September 2017. Under his leadership the business successfully transformed into a leading player in the global electronics materials market. Beyond Merck, he has several external mandates such as President of the German Federation of Chemical Employers' Associations and Chairman of the Advisory Board of Fraunhofer Institute for Computer Graphics Research.
Benjamin Loh was appointed Chair of the Management Board and President and CEO of ASM in May 2020. He is a non-executive director of ASMPT and in the past held positions as non-executive director at Schneeberger, Schweiter Technologies AG, and Liteq BV. Loh was a SEMI China regional advisory board member while employed with Unaxis Corporation and living in China from 2021 to 2005.
Suggested Items
iNEMI Names Grace O'Malley CTO
05/02/2024 | iNEMIThe Board of Directors of the International Electronics Manufacturing Initiative (iNEMI) has named Grace O'Malley Chief Technical Officer (CTO).
The New Industry: Will the Growth Continue?
04/30/2024 | I-Connect007 Editorial TeamHow sustainable are the primary financial models in the United States regarding PCB fabrication shops? In this interview with economic experts Shawn DuBravac and Tom Kastner, we explore what’s happening with U.S. printed circuit board shops in today’s market, how consolidation affects the industry, and what can be done.
Real Time with… IPC APEX EXPO 2024: Tools, Training, and Trends in Manufacturing Engineering
04/25/2024 | Real Time with...IPC APEX EXPOGuest Editor Kelly Dack and Product Specialist Erik Bateham of Polar Instruments discuss Polar's latest technology, including their role in aiding manufacturing engineers. They highlight the advanced capabilities of Polar's tools and the critical role of signal integrity analysis, as well as the importance of accurate modeling in board manufacturing. Polar's unique training approach and demonstration contact details are also explored.
Determining the Value-add of Box Build
04/24/2024 | Nolan Johnson, I-Connect007At a strategic level, adding box-building services makes sense for customer loyalty. But is it really that simple? Jon Schmitz, who manages customer engagement at RiverSide Integrated Solutions, talk about about what it really takes to be successful in offering EMS and final assembly services under the same company banner.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.