Cadence AI-Driven Multiphysics System Analysis Solution Enables Wistron to Dramatically Accelerate Product Development
December 22, 2023 | Cadence Design SystemsEstimated reading time: 1 minute
Cadence Design Systems, Inc. announced that Wistron, a leading technical service provider (TSP), has adopted and deployed the new AI-driven electromagnetic (EM) in-design analysis workflow, including the Cadence® Optimality™ Intelligent System Explorer and the Cadence Clarity™ 3D Solver, to design a complex 800G network switch. Using the Optimality Explorer’s AI-driven optimization technology and the Clarity 3D Solver for fast, accurate and scalable EM in-design analysis, Wistron was able to analyze large volumes of data—improving overall design reliability while realizing a 2X improvement in turnaround time (TAT).
Legacy 3D solvers typically deliver slower simulation results due to excessive run times and memory usage. In contrast, the Clarity 3D Solver, with its distributed multiprocessing technology and virtually unlimited capacity, quickly analyzes large and complex PCB, IC packaging and complete systems without compromising accuracy. Its exceptional performance is further fueled by the Optimality Explorer, a generative AI-driven, in-design multiphysics system analysis and optimization solution that allows design engineers to explore 3D EM and high-speed signal and power integrity results efficiently and effectively. By revealing design configurations that may not be manually achievable, the Optimality Explorer streamlines design iterations—resulting in shorter and more efficient design cycles.
“By adopting Cadence’s AI-driven optimization solution including Optimality Explorer alongside the Clarity 3D Solver for our 800G network switch and GPU server, we leveraged the design of experiments model to explore multiple simulations quickly and realized far more robust designs with a 2X improvement in TAT,” said Christopher Huang, vice president of the Enterprise and Networking Business Group at Wistron. “With a shift left of AI-enabled multiphysics systems analysis into our electronic design workflow, we are not only improving product performance but gaining valuable design insight and engineering efficiencies.”
“As high-speed electronic systems continue to grow in complexity to meet market demands, Cadence is committed to developing software solutions that address multiphysics challenges and the associated scaling demands,” said Ben Gu, corporate vice president of the Multiphysics System Analysis Group at Cadence. “Wistron has embraced the Cadence multiphysics system analysis portfolio to expedite design throughput and engineering turnaround time. The Clarity and Optimality solutions, coupled with HPC, are the trifecta for next-generation design success.”
The Clarity 3D Solver and the Optimality Explorer support Cadence’s Intelligent System Design™ strategy, which enables customers to accelerate system innovation.
Suggested Items
TactoTek Licenses IMSE Technology to Polestar for Sustainable Electronics Design Innovation
05/15/2024 | TactoTekPolestar, the Swedish electric performance car brand, and Finnish smart surface pioneer TactoTek, have entered a collaboration to explore integration of Injection Molded Structural Electronics (IMSE) technology into Polestar’s vehicle programs.
The Shaughnessy Report: Unlock Your High-speed Material Constraints
05/15/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportThe world of PCB materials used to be a fairly simple one. It was divided into two groups: the “traditional” laminates, often called FR-4, and the high-speed laminates developed especially for high-speed PCBs. These were two worlds that usually didn’t collide. But then traditional laminates started getting better, and high-speed designers and design engineers took notice and started to reconsider what FR-4 could be used for.
Standard of Excellence Collaboration—The Right Path to Innovation
05/15/2024 | Anaya Vardya -- Column: Standard of ExcellenceNow more than ever, as new and innovative technologies for printed circuit boards are in demand, we need collaboration between PCB designers, fabricators, and assemblers. Close partnerships with PCB designers and assemblers are key to developing and producing PCBs with boards with new and innovative technology. These collaborative partnerships, along with the partnership with the end customers, are more critical than ever before.
A Potpourri of Design PD Classes
05/14/2024 |What is invention without innovation? What is innovation without capability? Kelly Dack addresses these questions and more in this review of the Professional Development courses at IPC APEX EXPO, including the flex course lead by "Flexperts" Mark Finstad and Nick Koop.
Real Time with… IPC APEX EXPO 2024: Precision Tools and Problem-solving With Perfect Point
05/14/2024 | Real Time with...IPC APEX EXPOIn an interview with Guest Editor Dan Beaulieu, Alex Girardot, a field applications engineer with Perfect Point, shares his experiences with precision tooling. Alex also discusses a challenging project involving thick boards and small diameter holes in which Carbonite tools with a hybrid design were used. They also discuss the trend toward smaller hole sizes.