Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Airbus Expands its Earth Observation Constellation with Pléiades Neo Next

04/29/2024 | Airbus
Airbus has launched the Pléiades Neo Next programme to expand its very high resolution Earth observation constellation. This new programme will result in new satellite assets and capabilities, including enhanced native resolution.

US Department of Defense Selects Intel Foundry for Phase Three of RAMP-C

04/23/2024 | Intel
The U.S. Department of Defense (DoD) has awarded Intel Foundry Phase Three of its Rapid Assured Microelectronics Prototypes - Commercial (RAMP-C) program.

Intel Gaudi, Xeon and AI PC Accelerate Meta Llama 3 GenAI Workloads

04/22/2024 | Intel Corporation
Meta launched Meta Llama 3, its next-generation large language model (LLM). Effective on launch day, Intel has validated its AI product portfolio for the first Llama 3 8B and 70B models across Intel® Gaudi® accelerators, Intel® Xeon® processors, Intel® Core™ Ultra processors and Intel® Arc™ graphics.

Intel Brings AI-Platform Innovation to Life at the Olympic Games

04/18/2024 | BUSINESS WIRE
Intel announced its plans for the Olympic and Paralympic Games Paris 2024. Bringing AI Everywhere, Intel will implement artificial intelligence technology powered by Intel processors on the world’s biggest stage.

SMT Prospects and Perspectives: AI Opportunities, Challenges, and Possibilities, Part 1

04/17/2024 | Dr. Jennie Hwang -- Column: SMT Perspectives and Prospects
In this installment of my artificial intelligence (AI) series, I will touch on the key foundational technologies that propel and drive the development and deployment of AI, with special consideration of electronics packaging and assembly.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in