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The Knowledge Base: A CM’s Perspective on Box Build Practices

04/30/2024 | Mike Konrad -- Column: The Knowledge Base
In the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.

Latest Test and Inspection Solutions from GOEPEL electronic at SMTconnect 2024

04/29/2024 | GOEPEL electronic
GOEPEL electronic will be demonstrating automated test and inspection equipment at SMTconnect, taking place in Nuremberg from June 11 to 13, 2024.

IMAPS & IPC to Host Onshoring Workshop

04/16/2024 | IPC
The International Microelectronics Assembly and Packaging Society (IMAPS) and IPC will host an Onshoring Workshop to discuss ongoing progress and forward-looking strategies to drive the Onshoring Advanced Packaging and Assembly, April 29 – May 1, 2024, in Arlington, Virginia.

IPC WinterCom 2024 Through the Eyes of One Dedicated Student

04/12/2024 | Sanjay Huprikar, IPC
Lauriane Testuz stands as a testament to the power of curiosity, perseverance, and the relentless pursuit of knowledge. Her story serves as a reminder that the path to success is often paved by an unwavering commitment to one's dreams.

2023: Year of Extremes for VDL Groep

04/08/2024 | VDL Groep
The year 2023 showed us two sides, with highs and lows. Low points were the passing of Wim van der Leegte in November, the reduction in the number of employees at VDL Nedcar and headwind in the Buses & Coaches division.
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