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The October 2017 issue of SMT Magazine is available now. There are many perspectives and challenges in creating perfect solder joints. This month, we present parameters and strategies that can help assemblers improve their soldering process to achieve reliable solder joints.
Read the October issue of SMT Magazine, now on the virtual newsstand and available for delivery in your e-mailbox by subscribing here.
Save the PDF version to your devices for future reference.
Andy Shaughnessy, I-Connect007
At the SMTA Dallas Expo, Andy Shaughnessy sat down with Miles Moreau of KIC to discuss the company’s latest offering in wave process inspection technology. Miles also explains how KIC’s early focus on automated real-time process monitoring has enabled them to become a leader in Smart factory implementation.
Barry Matties, I-Connect007
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.
Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. José Servin has worked as an IPC member for more than 14 years in the development of the Electronics Assembly Norms. As a member of the IPC A-610 and J STD-001 working groups, he became chairman of IPC A-610G and J STD-001G Automotive Addendums that complements the norms for automotive industry since 2018.