GÖPEL electronic's SCANFLEX II Controller Now Also Available as PXIe


Reading time ( words)

Boundary Scan Controllers serve as the interface between the test PC/software and the target assembly in manufacturing or development. Based on state-of-the-art FPGA, SCANFLEX II controllers enable the application of powerful test and validation methods. They use instruments embedded in the electronic assemblies under test with reduced physical access to test and program them. In this context, the SFX II PXIe C4/FXT offers a unified control platform with 4 independent, true parallel Test Access Ports (TAP) for up to 100MHz. This enables the synchronised execution of embedded test, debug and programming operations via boundary scan (IEEE1149.x), processor emulation, chip integrated instruments or the embedded diagnostics procedure. Basic elements include a programmable, multifunctional 32-channel I/O mixed-signal unit with signal frequencies up to 100MHz, programmable TAP protocols for a variety of processor debug interfaces. The SFX II PXIe C4/FXT is controlled via a PXI Express x2 interface.

Due to its multifunctional architecture, the SFX II PXIe C4/FXT offers almost unlimited possibilities to combine all technologies, including mixed signal tests, flexibly and with highest performance on only one platform. This solution approach not only offers the advantage of significantly improved test depth for complex boards even without the use of needles, but it also minimises the number of necessary instruments. For example, embedded functional tests can be used to detect and diagnose dynamic faults, while the features for in-system programming (ISP) for flash components, micro-controllers and PLD/FPGA make other stand-alone programmers superfluous.

Thanks to a multitude of special extension and configuration features, the SFX II PXIe C4/FXT is also already equipped for future embedded technologies for testing, validation, debugging and programming. Using the PXI Express platform, external function tests can thus be easily combined with embedded procedures. The system is suitable for both development and production. As a result, it can be used for prototype design verification, hardware debugging, Flash programming, gang testing of high-volume units and diagnosing defective assemblies from the field to obtain the necessary repair information.

Share




Suggested Items

Optimizing Test Engineering Practices for High-Mix Electronics Manufacturing

08/15/2022 | Mark Laing, Siemens Digital Industries Software
For PCB and assembly manufacturers, test engineering has become a critical factor in enhancing the profitability of new product introductions (NPIs). Given the trend toward high-mix, low-volume production, the journey from design data to an automated PCB testing program must be quicker and more efficient than ever before. In this article, we will discuss how to optimize the efficiency of the test engineering process in accordance with these new market realities.

Getting Involved Earlier in the Test Process

04/18/2022 | Andy Shaughnessy, I-Connect007
At SMTA Dallas, Andy Shaughnessy stopped by the booth for The Test Connection, to find out from Bert Horner why the company has evolved into spending more time educating and consulting with their customers when it comes to testing new designs.

Automotive Initiatives Make Headway at IPC APEX EXPO

02/25/2022 | Tracy Riggan, IPC
A significant number of automotive activities made notable strides at this year’s IPC APEX EXPO. Several committees dedicated to creating and updating automotive addenda for existing IPC standards, like assembly processes, PCB fabrication, and high-voltage cable, met and were led by companies like Toyota, Bosch, Continental, and Elmatica. Automotive dedicated groups, like the Cold Joining/Press-fit Task Group, also met and discussed inclusions in its next planned revision.



Copyright © 2022 I-Connect007. All rights reserved.