Pin and Slant Fin Heat Sinks from ATS Offer Economical Electronics Cooling


Reading time ( words)

Advanced Thermal Solutions, Inc. (ATS) is now providing Pin and Slant Fin heat sinks made from lightweight, extruded aluminum to provide low-cost cooling solutions for many hot PCB components.

Pin Fin sinks have a high efficiency design that harnesses cooling airflow from any direction. They reliably perform in spatially constrained PCB layouts where the airflow direction is variable. The pin fin field has low pressure drop characteristics for effective cooling in low airflow environments. The combined large surface areas of the pins and base increases overall heat sink performance. Where space allows, taller and denser pin fin fields, with higher aspect ratios to their bases, further increase heat dissipating surfaces to provide even higher cooling performance.

For limited airflow situations in direction-specific applications, Slant Fin heat sinks provide substantial surface area, and therefore high cooling performance. The slanted fin field extends slightly beyond their base dimensions. Like with Pin Fin heat sinks, Slant Fin sinks are fabricated from single-piece extruded aluminum, which minimizes the thermal resistance from their base to their fins

Both Pin Fin and Slant Fin heat sinks are available for component sizes 10 x 10mm up to 60 x 60mm, and standard heights from 2 to 25mm.

Pin and Slant Fin heat sinks in all standard sizes can be attached with double-sided thermal tapes. Larger sinks can be further secured with clip-type hardware, including Z-clips, and ATS’ proven maxiGRIP and superGRIP easily-installed attachment systems.

Share




Suggested Items

KIC Adds Wave Monitoring Technology to Industry 4.0 Ecosystem for Thermal Processes

04/13/2022 | Andy Shaughnessy, I-Connect007
At the SMTA Dallas Expo, Andy Shaughnessy sat down with Miles Moreau of KIC to discuss the company’s latest offering in wave process inspection technology. Miles also explains how KIC’s early focus on automated real-time process monitoring has enabled them to become a leader in Smart factory implementation.

High-reliability, Low-temperature Solder Alloys

05/18/2020 | Dr. Pritha Choudhury, MacDermid Alpha Electronics Solutions
Increased digitalization and greater connectivity have been driving miniaturization and more complex and integrated designs in electronics. As the real estate on PCBs shrinks, so does the size of packages. However, the drive for finding design solutions for increased performance has continued to expand. The solder joint is an essential part of assemblies for electronic devices as it provides electrical, thermal, and mechanical connections. Therefore, soldering materials have been evolving to enable such a technological revolution.

Practical Verification of Void Reduction Method for BTC Using Exposed Via-in-pad

12/16/2019 | Alfredo Garcia, et al, Sanmina and Nokia
The method explored in this article regards the use of exposed via-in-pad. A dedicated test vehicle was designed for two types of QFN components. The main variables accounted for were the component size, number of exposed vias in the thermal pad, via pitch, via size, and solder paste coverage. The responses sought in this experiment include a thermal pad void level and solder wicking down the via barrel with resulting solder protrusion on the opposite side of the PCB.



Copyright © 2022 I-Connect007. All rights reserved.