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Indium Corporation will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and RF applications at the International Microwave Symposium, Denver, Colo., June 19–24.
Indium Corporation is the leading solder supplier for laser, optical, and RF microwave applications. Au-based alloys are a great choice to ensure the best performance and reliability possible for applications requiring a high-melting die-attach solder. In addition to meeting the demanding thermal and electrical requirements for high-reliability applications, they also provide the strongest corrosion- and oxidation-resistant solder joint possible. Semiconductor laser and RF power die-attach applications require the highest quality, ultraprecise solder preforms to ensure accuracy and repeatability during assembly for a guaranteed highly-reliable end product. Indium Corporation’s Au-based PDA preforms offer the highest level of quality available to deliver the best performance possible in critical, high-reliability die-attach applications. Features include:
- Highly accurate thickness control
- Precision edge quality, virtually burr-free
- Optimized cleanliness control
- Default waffle-pack method
Indium Corporation’s AuLTRA 75 is an off-eutectic AuSn preform solution (75Au25Sn) designed to improve intermetallic reliability in applications using a die with a thicker gold plating, such as a GaN die used for high-frequency, high-power RF power amplifier devices for 5G and other critical military and aerospace wireless communications. AuLTRA™ 75 helps improve the operation of these critical technologies by offering a lower gold content, allowing for the absorption of gold from the die, and thereby ensuring a strong solder bond.
AuSn preform solutions:
- Deliver improved wetting and voiding
- Allow for adjustment of the final solder joint composition
- Are available in 78Au22Sn and 79Au21Sn formulations
Indium Corporation’s AuLTRA™ ThInFORMS™ are 0.00035” thick (0.00889mm or 8.89μm) 80Au20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA™ ThInFORMS™ help combat common issues such as:
- Shorting—reduced solder volume inhibits wicking up the die, minimizing the risk of shorting
- Poor thermal transfer—the ultra-thin 0.00035” preform reduces bondline thickness, thus improving thermal transfer and increasing the longevity and performance of the device.
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