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ASC International Launches High-speed, Sophisticated Inline 3D SPI
June 6, 2022 | ASC InternationalEstimated reading time: 1 minute
ASC International, a leading manufacturer of 3D solder paste inspection (SPI) and automated optical inspection (AOI) systems, is pleased to announce that the LineMaster Fusion 3D takes inline SPI to a new level with its unmatched price to performance value proposition. The Fusion 3D provides all of the required features for high-speed inline 3D solder paste inspection at an amazingly affordable price.
The LineMaster Fusion 3D provides sophisticated 3D solder paste measurement coupled with an intuitive user interface and Windows 10 OS. With only a few minutes of training, an operator can perform accurate and reliable 3D measurements of solder paste deposits as well as many other important SMT measurement applications. LineMaster's completely automatic solder paste measurement process eliminates manual board handling as found with offline SPI systems and provides operators with immediate feedback to reduce printer related defects.
With industry-leading 4um X-Y pixel resolution and .17um Z height resolution sensor technology, the Fusion 3D provides exceptional value for the electronics manufacturer concerned with improving production yields hindered by poor overall quality of their print process. The SPI system features five-minute Gerber/CAD import programming with fully integrated SPC analytics, real-time data review and qualitative analysis of solder paste deposition utilizing realistic 3D rendering for accurate print quality detection.
Suggested Items
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
04/16/2024 | MacDermid Alpha Electronics SolutionsIn the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies.
New Book on Low-temperature Soldering Now Available
04/17/2024 | I-Connect007I-Connect007 is pleased to announce that The Printed Circuit Assembler’s Guide to… Low-temperature Soldering, Vol. 2, by subject matter experts at MacDermid Alpha Electronics Solutions, is now available for download.
Inkjet Solder Mask ‘Has Arrived’
04/10/2024 | Pete Starkey, I-Connect007I was delighted to be invited to attend an interactive webinar entitled “Solder Mask Coating Made Easy with Additive Manufacturing,” hosted by SUSS MicroTec Netherlands in Eindhoven. The webinar was introduced and moderated by André Bodegom, managing director at Adeon Technologies, and the speakers were Mariana Van Dam, senior product manager PCB imaging solutions at AGFA in Belgium; Ashley Steers, sales manager at Electra Polymers in the UK; and Dr. Luca Gautero, product manager at SUSS MicroTec Netherlands.