Thin PCBs for Smart Phones: Technology and Reliability Considerations


Reading time ( words)

Abstract

The next generation of smartphones will demand very thin multilayer boards to reduce product thickness again. This paper shows three  different manufacturing approaches which can be used for very thin, any-layer build-ups. The technological approaches are compared on reliability level—the any-layer copper filled microvia technology which is to be considered as state-of-the-art technology for high-end phones and the ALIVH-C/G technology that is well established in Japan. 

A test vehicle design featuring test coupons for comprehensive reliability test series has been defined as target application for investigation. The applied test vehicle build-ups comprise an eight-layer build-up with total board thickness below 500 µm. The first test vehicle is based on an any-layer HDI build-up including copper filled stacked microvia structures, the second test vehicle features a 1+6+1 ALIVH-C build-up comprising an outer HDI prepreg layer, while the third test vehicle is built in ALIVH-G technology featuring a full ALIVH build-up.

The influence of the applied manufacturing technology on the reliability performance of thin PCBs is evaluated based on these three test vehicle build-ups.

To cover the behavior during SMD component assembly the produced samples are subjected to reflow sensitivity testing applying a lead-free reflow profile with a peak temperature of +260ºC. Failure occurrence and the observed failure modes are evaluated and compared.

In parallel, a temperature cycling test is conducted on the test vehicles in a temperature range between -40ºC and +125ºC to evaluate the thermo mechanical reliability of the test vehicles with regard to the manufacturing technology.

To characterize the reliability aspects influenced by electrochemical migration phenomenon the different samples are subjected to a HAST test at +130ºC with 85% humidity level.

The results obtained from reliability testing are summarized and compared within this paper. The identified relations between manufacturing technology and the reliability performance of the test vehicles are shown; strengths as well as weaknesses of the applied any-layer technologies are identified and summarized.

Read the full article here.


Editor's Note: This article originally appeared in the October issue of The PCB Magazine.

Share




Suggested Items

Review: Institute of Circuit Technology 2022 Annual Symposium

06/15/2022 | Pete Starkey, I-Connect007
The British Motor Museum in Warwickshire, housing the world's largest collection of historic British cars, was venue for the 2022 Annual Symposium of the Institute of Circuit Technology on June 8, which attracted a substantial gathering of manufacturers and suppliers from the UK printed circuit industry. ICT chair Emma Hudson reflected upon lessons learned during the pandemic lock-down and how the industry has successfully adapted to circumstances. She commented that the UK’s PCB fabricators are extremely busy, as she introduced an outstanding conference programme including a keynote from the incomparable Happy Holden.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/20/2022 | Andy Shaughnessy, I-Connect007
This week, we bring you an article about manufacturing training for veterans, and a review of a great signal integrity webinar. IPC honors its A-Teams with the coveted Golden Gnome Awards, and Technica discusses various ways for fabricators to increase ROI. Dan Beaulieu has a review of a really cool book: Back to Human—How Great Leaders Create Connection in the Age of Isolation. In spite of all the meetings on Teams and Zoom, it’s easy to feel disconnected. But great leaders find a way to foster that connectivity.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

05/13/2022 | Nolan Johnson, I-Connect007
The big news in the industry this week was the new bill introduced to the U.S. Congress in support of the PCB manufacturing industry. The Supporting American Printed Circuit Boards Act of 2022, which was introduced by Reps. Anna Eshoo (D-CA) and Blake Moore (R-UT), incentivizes “purchases of domestically produced PCBs as well as industry investments in factories, equipment, workforce training, and research and development.” The bill is a PCB-oriented complement to the semiconductor-oriented CHIPS Act of 2021.



Copyright © 2022 I-Connect007. All rights reserved.