-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Rework Challenges for Smartphones and Tablets
November 19, 2014 |Estimated reading time: 1 minute
Smartphones are complex, costly devices and therefore need to be reworked correctly the first time.
To meet the ever-growing demand for performance, the complexity of mobile devices has increased immensely, with 70% more packages now found inside a mobile device than just a few years ago. For instance, a 1080P HD camera with video capabilities is now available on most high-end smartphones or tablet computers, making their production more elaborate and expensive.
The printed circuit boards for these devices are no longer considered disposable goods, and their bill of materials start from $150, with higher-end smartphones going up to $238, and tablets well over $300.
The implementation of surface mount devices is crucial for smartphone manufacturers, offering increased component density and improved performance. For example, the newer style DDR memory integrated components use less power and work at twice the speed of former versions. It is not surprising that most component manufacturers now produce these surface mount devices as small as 1 mm square.
Mobile products generally use an epoxy underfill to adhere components to the printed circuit board to meet the mechanical strength requirements of a drop test. Reworking glued components is the most difficult application in the electronics industry, and must be addressed as a process.
Rework Challenges
The removal of a glued component from a PCB assembly requires a specific order of operations. The first step is to remove the glue fillet located between the component and the circuit board. Mobile products generally have many types of components glued to the PCB in order to meet the industry standards outlined in JESD22-B111 Board Level Drop Test Method of Components for Handheld Electronic Devices and JESD22-B110 Subassembly Mechanical Shock. The epoxy is applied to the components to prevent the common failure modes of cracks in the laminate, cracks near the intermetallic, and cracks in the bulk solder. The addition of the epoxy increases the robustness of the design and enhances reliability for the user.
Read the full article here.
Editor's Note: This article originally appeared in the November 2014 issue of SMT Magazine.
Suggested Items
Real Time with... IPC APEX EXPO 2024: all4-PCB, A Premier Solution Provider for the PCB Industry
04/22/2024 | Real Time with...IPC APEX EXPOIn the PCB industry, all4-PCB, is a top-tier equipment supplier and process solution provider. Ralph Jacobo highlights the active market and the demand for high-quality equipment, discusses their existing customers, investment in advanced substrates, and smaller board shops.
The Pulse: Drilling Down on Documentation
04/18/2024 | Martyn Gaudion -- Column: The PulseHow did a product aimed at signal integrity end up being more about documentation? For a little backstory, the Polar team has an unspoken “no business speak” rule at certain times. So, why is this column titled “Drilling Down?” I find it fascinating when a company sets off in one direction, but customers steer it in another. That’s what has happened here as customers took a product down a fork in the road we couldn’t predict. Your destination isn’t always where you initially set off to go, and that’s how we got to our subject of drills and drill documentation.
Real Time with... IPC APEX EXPO 2024: IPC Government Relations Holds Lawmakers Accountable
04/16/2024 | Real Time with...IPC APEX EXPOThe IPC Government Relations team is constantly educating Congress and the executive branch about the importance of a robust domestic electronics manufacturing industry. As Richard Cappetto explains, the GR team is focused on proactive strategies, workforce policies, and sustainability, as well as the significance of apprenticeship programs, President Biden's executive order, and employer incentives. Also discussed is the PCB Act, its investment program, tax incentive, and DoD's understanding of supply chain risk.
Catching Up With Chasom Electronics
04/16/2024 | Dan Beaulieu, D.B. Management GroupI recently met with Chasom Electronics’ founding director Anil Kumar. Chasom offers a unique menu of services for companies looking to extend their technology capabilities on a short- or long-term basis. Read on to learn about this very unique service company.
Marcy's Musings: The Growing Industry
04/16/2024 | Marcy LaRont -- Column: Marcy's MusingsAfter decades of steady decline in the U.S. and Europe, the PCB industry is finally growing, especially in China Plus One countries. The U.S. for example, which seemed to have abdicated its title as the world leader in innovating high-technology cutting-edge manufacturing processes, is now in a race to regain what it lost and then some. The PCB fabrication industry is growing in the West, thanks to DoD funding, the CHIPS and Science Act, and hopefully, the passing of HR 3249, the Printed Circuit Board and Substrates Act.