Oxide vs. Oxide Alternative, Part 2


Reading time ( words)

In last month’s column, I presented an overview of conventional oxide chemistry and the critical success factors of the process. In this column, we begin our review of the oxide alternative process that is often referred to as an organo-metallic coating process. The reason for this alternative name will be explained in this column.

With continued emphasis on long-term reliability and vastly improved electrical performance, manufacturers of high layer-count multilayer printed wiring boards are beginning to abandon the reduced oxide bonding process in favor of alternative methods. One such method, presented here as an organo-metallic adhesion promotion system, increases the bond strength of the resin to the copper by modifying the topography of the copper surface and simultaneously depositing an organic layer that acts as an adhesion promoter. The surface area or topography of the copper is enhanced by the selective micro-etching along the grain boundaries of the copper. (This mechanism will be discussed further below.) This is in contrast to the oxide-based chemical processes in that the oxide processes are designed to “grow a crystal structure” on the copper surface. The concern with oxide processes (even the formulations designed to give a denser shorter crystal structure) is that the higher pressures and temperatures of lamination required for higher performance laminate materials will fracture the oxide crystal structure reducing the bond strength. With that said, let’s discuss oxide alternative or organo-metallic chemistry and how it all works.

Read the full column here.


Editor's Note: This column originally appeared in the March 2014 issue of The PCB Magazine.

Share




Suggested Items

ICAPE: Staying on Top During ‘Interesting’ Times

12/05/2022 | Nolan Johnson, PCB007 Magazine
Recently, we met with Nathan Martin, group purchasing director; Jean-Christophe Miralles, supply chain director for Europe and U.S., and Lea Maurel, Americas marketing manager. This wide-ranging conversation dug into market drivers, supply chain challenges and how ICAPE creates consistency on its manufacturing floor. Complementing the supply chain control is ICAPE’s engineering experise, which it uses to increase customer yields and quality. Corporate sustainability is a key strategic initiative for ICAPE, and it was enlightening to learn just how holistic ICAPE’s approach to sustainability is.

Optimize Your Etcher for Best Image Quality

11/03/2022 | Christopher Bonsell, Chemcut
When it comes to obtaining high-quality images, many different factors come into play. Typically, most of these factors come down to your imaging equipment and cleanroom; however, there are factors involved in the etching process that can affect the quality of your image. Here are five steps to ensure your etching process is optimized for the best image quality.

Millennium Circuits on The Move

10/31/2022 | Andy Shaughnessy, Design007 Magazine
I recently met with Daniel Thau, CEO of Millennium Circuits Limited, at PCB West. This Pennsylvania-based PCB distributor has been on an expansion path lately, so I asked Daniel to introduce us to MCL and explain where the company is headed. As Daniel says, it’s all about impacting the world in a positive way.



Copyright © 2022 I-Connect007 | IPC Publishing Group Inc. All rights reserved.