Reading time ( words)
LPKF Laser & Electronics has announced it will exhibit at the 2015 Design & Manufacturing Canada expo, which takes place June 16-18 at the Toronto Congress Centre in Toronto, Canada. LPKF, a manufacturer of laser systems for a variety of applications, will showcase its laser solutions in booth 471.
One of the technologies highlighted by LPKF will be laser plastic welding; a process of bonding plastic using focused laser radiation. Clean-room compatibility and hygienic, particle-free processing make laser plastic welding ideal for the medical device industry. Potential applications range from microfluidic devices to catheters to intravenous tubing.
Another technology represented at Design & Manufacturing Canada will be UV laser depaneling, a stress-free method of removing individual circuits from larger panels. The stress-free nature of UV laser processing is perfect for medical electronics applications which feature flexible materials or carry sensitive components that could be damaged by mechanical depaneling methods such as routing or dicing. For more information on LPKF’s solutions, visit LPKF in booth 471 at Design & Manufacturing Canada or visit www.lpkfusa.com.
Established in 1976, LPKF Laser & Electronics manufactures milling machines and laser systems used in circuit board and microelectronics fabrication, medical technology, the automotive sector, and the production of solar cells. LPKF’s worldwide headquarters is located in Hannover, Germany and its North American headquarters resides near Portland, Ore.
Zac Elliott, Siemens Digital Industries Software
Let’s face it, in the past, electronics manufacturing has not been a big business for North America. A majority of electronics are assembled in Asia where supply chains and operating costs offer many economic advantages. In North America, the electronics manufacturing industry has been generally focused on lower volume, high-cost devices, while higher volume products are produced elsewhere. However, the COVID pandemic and various legislation in the U.S. are changing the situation, making electronics manufacturing in North America a more attractive option. How can factories in North America compete for the same type of manufacturing traditionally performed in lower-cost regions?
Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. José Servin has worked as an IPC member for more than 14 years in the development of the Electronics Assembly Norms. As a member of the IPC A-610 and J STD-001 working groups, he became chairman of IPC A-610G and J STD-001G Automotive Addendums that complements the norms for automotive industry since 2018.
Patty Goldman, I-Connect007
Doug Pauls holds a B.A. in chemistry and physics from Carthage College, Kenosha, Wisconsin, and a B.S. in electrical engineering from the University of Wisconsin, Madison. He worked nine years for the Navy, eight years as technical director of Contamination Studies Labs, and 19 years at Rockwell Collins (now Collins Aerospace), in the Advanced Operations Engineering group, where he is a principal materials and process engineer. Doug was awarded the Rockwell Collins Arthur A. Collins Engineer of the Year Award in 2004.