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Kurtz Ersa North America, a leading supplier of electronics production equipment, announces that it recently sold a new VERSAFLOW 3/66 selective soldering machine to Universal Scientific Industrial de Mexico (USI) S. A. de C.V. The system was installed and is in use at USI’s plant in Jalisco, Mexico.
USI purchased a dual conveyor unit with two fluxers and segmented top and bottom preheaters. Additionally, it has two solder modules and a total of four solder pots within the machine. Enrique Diaz, Industrial Manager, stated, “We chose ERSA because they are the only supplier in the market that offers dual conveyors. In addition to our excellent relationship with the ERSA team, they offer low maintenance costs, high performance and high quality yields close to 100 percent.”
The VERSAFLOW 3/66 is the world’s leading platform for selective soldering. The proven third generation technology offers the highest flexibility and highest volume throughput for PCBs sized up to 24" x 24". The use of high-precision servo gantry systems, electromagnetic pumping systems, dual solder pot capability, top- and bottom-side preheating capability, and modularity make ERSA the leader in selective soldering.
For more information about Universal Scientific Industrial de Mexico (USI) S. A. de C.V., visit www.usi.com.tw.
For more information about Kurtz Ersa North America, visit www.ersa.com.
Andy Shaughnessy, I-Connect007
I recently spoke with Rob Boguski, president of Fremont, California-based Datest and an SMTA vice president and board member. Rob explained why today’s test customers are asking for more information than the traditional pass/fail, offers a preview of SMTA International, and gives an update on SMTA’s planning strategy for the next five years.
Dr. Ronald C. Lasky, Indium Corp.
It may be difficult to see any bright spots in the current and recent economic situation. We have all experienced the devastation of the pandemic, supply chain issues, and most recently, inflation. However, as a senior technologist for an international materials supplier (Indium Corporation) and a professor of engineering at an Ivy League research university (Dartmouth College), I offer these four silver linings for those of us in the electronics industry.
Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.