SHENMAO Intros PF606-P26 Halogen Free No Clean Solder Paste


Reading time ( words)

SHENMAO PF606-P26 No-Clean / Zero Halogen Solder Paste are made locally in the USA and with the same quality in seven other worldwide locations. It is said to prevent BGA Non-Wet Opens and Head on Pillow defects if there is oxidation on BGA Balls or PCB Pads. In case BGA components are warped, PF606-P26 thru excellent printability, wetting and solder ability can create highly reliable Solder Joints that greatly reduce their failure rate.

SHENMAO produces SMT Solder Paste, Wave Solder Bar, Semiconductor Packaging Solder Spheres, Flux and PV Ribbon.

SHENMAO America, Inc. www.shenmao.com; Tel: 408-943-1755 e-mail: usa@shenmao.com

Share




Suggested Items

VJ Electronix: Automating the X-ray Inspection Process

05/04/2022 | Nolan Johnson, I-Connect007
VJ Electronix's Brennan Caissie shares the benefits of a new inspection tool that can be used on a variety of boards, with an automated system that takes the pressure off the manufacturing floor operators and can provide feedback all the way to the design process.

Dave Hillman on Living Your Passion

03/29/2022 | Barry Matties, I-Connect007
Barry Matties leads this engaging retrospective conversation with Dave Hillman, a Fellow, Materials and Process engineer at Collins Aerospace, who talks about mentorship, pandemic changes, and solder. “Soldering is soldering,” Dave says. “But how we do that keeps evolving in response to the new technologies and smaller packages.” What’s the key to his success and longevity? “Find your passion.” Here’s how he’s done it.

IPC’s Dieter Bergman Fellowship Award Presented to Bev Christian, HDPUG

03/14/2022 | Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Department of Mechanical and Mechatronics Engineering of the University of Waterloo, Waterloo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow.



Copyright © 2022 I-Connect007. All rights reserved.