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Bittele Electronics Inc., a Toronto-based firm specializing in prototype and low volume printed circuit board assembly, announced today that it has completed the construction of a new PCB assembly production line for prototype and low volume assembly. The new PCB assembly line is now open for production.
This new, fully automated, PCB assembly production line, featuring state-of-the-art technology, offers greater efficiency, cost savings and convenience to customers throughout the world. The benefits of this new PCB production line include:
- 100% machine placement of PCB board parts, even for single-piece orders.
- Automated assembly procedures, including PCB loading, paste printing, parts placement/installation, reflow process and AOI (Automatic Optic Inspection) inspection.
- A 10-zone reflow oven that ensures lead-free processing has the same quality as mass-produced processing.
- High quality solder paste, which is ideal for fine pitch assembly.
- An SMT machine that does not require extra parts to adapt to the feeder, which saves money.
“This new production line allows Bittele to serve its customers with flexibility, no matter what the order size," said says Ben Peng Yang, General Manager, Bittele Electronics, Inc.
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About Bittele Electronics
In business since 2003, Bittele has established itself as a premier provider of low cost, PCB assembly solutions. Bittele Electronics specializes in PCB Prototype Assembly and Low Volume Assembly services for electronic design engineers. It is headquartered in Toronto, Canada, with production facilities in China. Bittele Electronics is capable of meeting all assembly needs by consignment, partial Turn-Key or full Turn-key services.
Zac Elliott, Siemens Digital Industries Software
Let’s face it, in the past, electronics manufacturing has not been a big business for North America. A majority of electronics are assembled in Asia where supply chains and operating costs offer many economic advantages. In North America, the electronics manufacturing industry has been generally focused on lower volume, high-cost devices, while higher volume products are produced elsewhere. However, the COVID pandemic and various legislation in the U.S. are changing the situation, making electronics manufacturing in North America a more attractive option. How can factories in North America compete for the same type of manufacturing traditionally performed in lower-cost regions?
Patty Goldman, I-Connect007
The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collaborative spirit, made significant contributions to standards development, and have consistently demonstrated a commitment to global standardization efforts and the electronics industry. José Servin has worked as an IPC member for more than 14 years in the development of the Electronics Assembly Norms. As a member of the IPC A-610 and J STD-001 working groups, he became chairman of IPC A-610G and J STD-001G Automotive Addendums that complements the norms for automotive industry since 2018.
Patty Goldman, I-Connect007
Doug Pauls holds a B.A. in chemistry and physics from Carthage College, Kenosha, Wisconsin, and a B.S. in electrical engineering from the University of Wisconsin, Madison. He worked nine years for the Navy, eight years as technical director of Contamination Studies Labs, and 19 years at Rockwell Collins (now Collins Aerospace), in the Advanced Operations Engineering group, where he is a principal materials and process engineer. Doug was awarded the Rockwell Collins Arthur A. Collins Engineer of the Year Award in 2004.