Evolving Technologies Summit Focused Symposium at SMTA International


Reading time ( words)

The SMTA announced that the Evolving Technologies Summit will be held on September 28, 2015 as a focused symposium at SMTA International in Rosemont, Illinois. The purpose of the summit is to present the key issues in Printed Electronics, Advanced Packaging Technology, and Materials Innovations in order to gain insight regarding technology changes in the future. Co-sponsored by iNEMI, the symposium is organized by Reza Ghaffarian, Ph.D., Jet Propulsion Laboratories, Steve Greathouse, Plexus Corp. and Richard Coyle, Ph.D., Alcatel-Lucent. 

The morning sessions take on the topic of Alternate Alloys with research from Intel Corporation, Auburn University, and several top companies involved in materials development.

Murad Kurwa, Flextronics International, will then provide an exciting keynote lunch presentation called “Wearables Technology - The Next Manufacturing Wave.”

The afternoon session walks through Wearable Electronics Technology Development with presentations from National Physical Laboratory, DfR Solutions, and TechLead Corporation.

The Summit will end with a panel discussion. The Panel will present the status of new advanced technologies, then discuss and debate timely topics including 3D Packaging Technology Trends, Emerging Technologies, Renewable Energy, Optics and Photonics, Wearable Electronics, and Next Generation PCBs for Embedded Technologies.

Details about the Evolving Technologies Summit and SMTA International can be found online or contact Tanya Martin: 952-920-7682 or tanya@smta.org.

About SMTA

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Share




Suggested Items

CyberOptics: New Partnership Shows Promise for Semiconductor Industry

12/28/2022 | Nolan Johnson, I-Connect007
Nolan Johnson checks in with Sean Langbridge, European sales director for CyberOptics, at electronica to discuss details of the recent merger between CyberOptics and Nordson and the partnership’s potential benefits for customers, especially regarding solutions geared toward enhancing the accuracy of test and inspection in advanced packaging. The company’s unique optical technologies, including its MRS sensors and AI² software, are already saving customers hours on the line; with Nordson’s X-ray capabilities in the mix, CyberOptics sees some very compelling technological solutions on the horizon.

Essemtec: Manufacturing Moves In-house

12/28/2022 | Pete Starkey, I-Connect007
Pete Starkey talks with Kevin Domancich at Essemtec at electronica 2022 about the company integration within Nano Dimension and how the two companies have pioneered an exciting new end-to-end manufacturing solution that helps customers speed up production, cut costs, and keep their proprietary materials secure. In a world where time to market has become a priority consideration, this universal system has the potential to revolutionize the industry.

The ‘Intel’ on Advanced Packaging Options

11/29/2022 | Nolan Johnson, I-Connect007
Dr. Tom Rucker is vice president in technology development at Intel and was a keynote speaker at the IPC Advanced Packaging Symposium, which helped set the table for the rest of the agenda. Tom understands this “radical and seismic” shift in terms of technology and breaks down what it means for the semiconductor and PCB fab industries. There’s absolutely a place at the table for PCB fabricators, but what are the first steps?



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.