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SHENMAO PF606-P26 No-Clean / Zero Halogen Solder Paste are made locally in the USA and with the same quality in 7 other world wide locations. It is said to prevent BGA Non-Wet Opens and Head on Pillow defects if there is oxidation on BGA Balls or PCB Pads. In case BGA components are warped, PF606-P26 thru excellent printability, wetting and solder ability can create highly reliable Solder Joints that greatly reduce their failure rate.
A Major Chipset Producer is recommending the use of SHENMAO PF606-P26 Solder Paste to achieve ultimately reliable connections to the PCB.
As the Worlds Major Solder Materials Provider, SHENMAO produces SMT Solder Paste, Wave Solder Bar, Semiconductor Packaging Solder Spheres, Flux and PV Ribbon.
Barry Matties, I-Connect007
As the definition of sustainably evolves in the industry, one thing is clear: Process control plays a large role in any definition. Creating a stable process reduces the potential overuse of cleaning materials and increases yields, thereby reducing scrap, and helping the sustainability effort. I recently talked with Tom Forsythe, executive vice president of KYZEN, about the cleaning process and automated bath control.
I-Connect007 Editorial Team
Since training is such a key component in converting an inexperienced new hire into a valued contributor on the manufacturing floor, we asked Brenda Clunie, vice president of sales and operations at EPTAC, exactly how their certification programs deliver on this promise for new hires.
Andy Shaughnessy, Design007 Magazine
At the Atlanta SMTA Expo and Tech Forum, I met Neil Hubble, president of the metrology systems provider Akrometrix. If you’re not sure exactly what metrology entails, you’re in luck. In this interview, Neil explains why metrology is becoming a critical part of PCB manufacturing. We also discuss the company’s capital equipment, testing services, and why Akrometrix counts many of the top PCB and semiconductor manufacturing companies in the world as their customers.