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IPC—Association Connecting Electronics Industries is seeking technical posters for presentation at the upcoming IPC APEX EXPO 2016 trade event, which will be held from March 15 to 17, 2016, at the Las Vegas Convention Center in Las Vegas, Nevada.
Submissions are being sought in all areas of the electronics industry, including design, materials, assembly, processes, and equipment; and topics may be on automation in electronics manufacturing, adhesives, assembly and rework processes, BGA/CSP packaging, black pad and other board-related defect issues, business and supply chain issues, cleaning, conformal coatings, corrosion, counterfeit electronics, failure analysis, flexible circuitry, PCB fabrication, robotics, soldering, surface finishes, test, inspection and AOI, tin whiskers, and many more.
The deadline for submission of abstracts is on December 11, 2015.
For more information about conference participation, please contact IPC Technical Conference Director Jasbir Bath or IPC Technical Programs Coordinator Toya Richardson at +1 847-597-2823.
Nolan Johnson, I-Connect007
This week, our five must-reads include the IPC report on the EMS industry and a report on ICs for the automotive market. Add to that Lockheed’s highest powered DoD laser yet, IPC’s APEX keynote announcement, and—for you conference and expo junkies—a calendar of upcoming industry events. I can’t help but notice that much of our news is about, well, something new. In this case, my editor’s picks for the week capture new technology, new perspectives, new ways to communicate content, and new developments that we can expect to see in our future daily life. To borrow a phrase from the TV show “Firefly,” everything is “shiny” this week. I will be at PCB West, the IPC Advanced Packaging symposium, SMTA International, and electronica. If you see me, say hello, and share something cool about the part of the industry you’re in.
I-Connect007 Editorial Team
Michael Carano is a noted subject matter expert with respect to process control, electroplating and metallization technology, surface finishing, and reliability. So, it was only natural that we sat down to talk about mechanizing an existing facility given today’s fickle environment. Will any of the CHIPS funding trickle down to bare board fabrication? What process can be adjusted on the factory floor? The focus needs to be more than just on manufacturing and getting work out the door, he says, but also process control.
Andy Shaughnessy, Design007 Magazine
It’s officially fall now, and in Atlanta the temperature has plummeted to the mid-80s. We’ve all bumped our air conditioners up to 74 degrees. That means it’s trade show season, and I’ve been busy looking for my suitcase. This week, we have an assortment of news about associations, education, and advocacy, as well as another installment of our Printed Electronics Roundtable. And if you’re looking for a job, you are in luck; our jobConnect007 section is chock-full of open positions at all levels in this industry.