IPC Seeks Posters for Display and Presentation at IPC APEX EXPO 2016


Reading time ( words)

IPC—Association Connecting Electronics Industries is seeking technical posters for presentation at the upcoming IPC APEX EXPO 2016 trade event, which will be held from March 15 to 17, 2016, at the Las Vegas Convention Center in Las Vegas, Nevada.

Submissions are being sought in all areas of the electronics industry, including design, materials, assembly, processes, and equipment; and topics may be on automation in electronics manufacturing, adhesives, assembly and rework processes, BGA/CSP packaging, black pad and other board-related defect issues, business and supply chain issues, cleaning, conformal coatings, corrosion, counterfeit electronics, failure analysis, flexible circuitry, PCB fabrication, robotics, soldering, surface finishes, test, inspection and AOI, tin whiskers, and many more.

The deadline for submission of abstracts is on December 11, 2015.

For more information about conference participation, please contact IPC Technical Conference Director Jasbir Bath or IPC Technical Programs Coordinator Toya Richardson at +1 847-597-2823.

Share




Suggested Items

Why Gold Layer Thickness in ENIG Matters for Soldering

02/07/2023 | Britta Schafsteller, Mario Rosin, Gustavo Ramos, and Joe McGurran, Atotech
The main task of the final finish is to protect the copper pad from tarnishing or oxidation while simultaneously keeping the surface active for the assembly. Electroless nickel/immersion gold (ENIG) is a widely accepted finish in the market that provides a good solderability and capability for Al-wire bonding. A main function of the gold layer is to prevent the oxidation of the nickel layer.

Preventing De-wetting Defects In Immersion Tin Soldering

01/04/2023 | Britta Schafsteller, Atotech
Immersion tin is well accepted as a high-reliability final finish in the industry. Due to its excellent corrosion resistance, it exhibits major market shares, particularly in the automotive industry. During the soldering process, an intermetallic compound (IMC) is formed between copper and tin. One remaining concern in the industry is the potential impact of the IMC on the solderability of the final finish. In this article, typical failure modes in soldering immersion tin are described and correlated to potential root causes for the defects.

ICT Christmas Seminar 2022: The Caliber of a ‘World Cup’ Event

12/13/2022 | Pete Starkey, I-Connect007
Regardless of the potential distraction of the international football match between England and Wales in the World Cup competition, an enthusiastic crowd of PCB fans gathered in Meriden UK for the Institute of Circuit Technology Christmas Seminar, an eagerly-awaited networking opportunity that included a face-to-face industry welcome event and an outstanding technical programme. Guest speakers highlighted new technology in selective solder nozzles, flexible circuits, industry cooperation, and a greener future by recycling PCBs.



Copyright © 2023 I-Connect007 | IPC Publishing Group Inc. All rights reserved.