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There is an increasing demand for a fast-curing structural adhesive capable of providing robust direct adhesion to low surface energy plastics. L&L A-K540 from Intertronics is a new, innovative structural adhesive. It is unique in that it combines direct adhesion – without primers or plasma, corona, or flame treatment – to low energy substrates such as polypropylene and polyethylene thermoplastics, with very fast cure speeds at room temperature. A-K540 is also capable of bonding a multitude of other substrates, enabling combinations of polyolefin plastics with metal and composite substrates.
A-K540 is a two-component methacrylate based structural adhesive which is fast curing (with a fixture time of just 45-60 minutes). It has high tensile strength and impact resistance with robust long term durability for applications in challenging operating conditions. It is resistant to weathering, e.g. salt spray and QUV radiation – properties developed in response to its original purpose in vehicle assembly applications where it has proven extremely successful worldwide, offering exemplary performance as a high strength, light-weight structural adhesive for major motor manufacturers.
Noelle Lovern, Consultant
There has long been a battle between environmental groups and the mining industry. Environmental groups push for clean energy and net zero carbon initiatives while the U.S. mining industry is buried deeper and deeper under overly burdensome permitting processes and relentless lawsuits that halt exploration, construction, and clean production of critical minerals.
Barry Matties, I-Connect007
At I-Connect007, we are proud to once again sponsor the STEM Outreach Program at the upcoming IPC APEX EXPO 2020. Another way we support our youth is by sharing the stories of young people who are doing amazing things. Dylan Nguyen is a great student, musician, and creative thinker. Recently, he shared with me the details of his school science fair project, “Kite: Powering the Future,” which solved a problem that he faced. Dylan is a leader with a bright future, and the world is lucky to have kids like him.
Glen Thomas, Ph.D., and Bill Cardoso, Ph.D., Creative Electron Inc.
As aerospace companies consider the shift to lead-free solder alloys and glues, concerns have been raised about whether their current X-ray inspection and quality-control procedures will still be valid. With lead solder, joints are easily interpreted by the operator or the system imaging software because lead provides excellent image contrasts due to relatively high X-ray absorption compared to that of PCB and component materials. Will this hold true as they shift to lead-free solder compounds?