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BAE Systems Selected to Develop Ground System Prototype for u.s. Space Force Missile Warning System

02/29/2024 | BAE Systems
BAE Systems has been selected by the Space Systems Command (SSC) Space Enterprise Consortium (SpEC) to provide a prototype ground system for the U.S. Space Force’s SSC Future Operationally Resilient Ground Evolution Command and Control (FORGE C2) project.

Indium Corporation to Feature New Semiconductor Products for HIA and SiP at IMAPS Device Packaging Conference

02/29/2024 | Indium Corporation
As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 20th International Conference and Exhibition on Device Packaging hosted by IMAPS, March 18‒21, in Fountain Hills, AZ.

Indium Corporation Advisor to Present, Host Tutorial at TestConX 2024

02/14/2024 | Indium Corporation
Indium Corporation advisor, and founder/principal of DS&A LLC, Dave Saums will present on innovative thermal materials for semiconductor testing at TestConX 2024, held in Mesa, AZ, March 3-6.

Northrop Grumman’s Mobile Ground-Based Solutions To Get Any Data, Any Time, For Any US Navy, Marine Corps Mission

01/18/2024 | Northrop Grumman
Northrop Grumman Corporation continues to pioneer the latest mobile ground station technology for the frontline with its recently awarded Maritime Targeting Cell – Expeditionary (MTC-X) contract.

RTX's Raytheon to Build Defensive Microwave Antenna Systems for U.S. Military

12/28/2023 | RTX
Raytheon, an RTX business, will design, build and test two high-power microwave antenna systems that will use directed energy to defeat airborne threats at the speed of light. The systems are designed to be rugged and transportable for front-line deployment.
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