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Kurtz Ersa North America is seeing strong demand for its new equipment, including rework systems, N2 wave soldering and selective soldering systems. To keep up with growing demand, Atlantech Inc.—which manages and sells to the Mid-Atlantic States, including Maryland, Washington D.C., Delaware, Virginia, West Virginia, North Carolina, and South Carolina for the past 12 years with Kurtz Ersa—has hired Bryce Timms as its newest sales representative in Eastern Tennessee, South Carolina, Georgia, and selected accounts in North Carolina.
"I am so very pleased to have Bryce on board," said Nagy Bayoumi, president of Atlantech. "His expertise is a solid fit for us. Our customers' equipment requirements are highly technically demanding, for which Ersa provides the solutions. Bryce understands these needs."
Atlantech established itself as an engineering and process solutions company in March of 1990 to service the printed circuit board (PCB) industry. As the industry took a downturn, Atlantech redirected its efforts and knowledge to focus on the SMT and microelectronics industries in the early 2000s.
Timms brings expertise in product management and application/service engineering in through-hole and selective soldering technologies to represent Ersa's new line of selective solder, reflow and rework equipment, and more.
"I am thrilled to have the opportunity to represent Ersa, and to be with Atlantech," commented Timms. "I know the demands of our customers, so I know that Ersa's high-end equipment, capabilities and service will absolutely meet those demands."
Narahari S Pujari and Krithika PM, MacDermid Alpha Electronics Solutions
The interdigitated back contact (IBC) is one of the methods to achieve rear contact solar cell interconnection. The contact and interconnection via rear side theoretically achieve higher efficiency by moving all the front contact grids to the rear side of the device. This results in all interconnection structures being located behind the cells, which brings two main advantages. First, there is no frontside shading of the cell by the interconnection ribbons, thus eliminating the need for trading off series resistance, losses for shading losses when using larger interconnection ribbons. Second, a more homogeneous looking frontside of the solar module enhances the aesthetics.
I-Connect007 Editorial Team
Solder defects in surface-mount technology (SMT) assembly have been an issue for decades. Further, the combined challenges of Pb-free soldering and ever-increasing miniaturization have resulted in new or exacerbated defects in electronics assembly, but there are proven ways to avoid defects. This book will be especially beneficial to PCB assemblers in improving their assembly processes and the reliability of the end-product, eliminating field failures, and reducing costs.
Andy Shaughnessy, I-Connect007
At the SMTA Dallas Expo, Andy Shaughnessy sat down with Miles Moreau of KIC to discuss the company’s latest offering in wave process inspection technology. Miles also explains how KIC’s early focus on automated real-time process monitoring has enabled them to become a leader in Smart factory implementation.